Institut Francais Du Pe'trole

Centre D'etude Des Materiaux Organiques Pour Technologies Avancees

Institut Francais Du Petrole, Des Carburants Et Lubrifiants

Centre D'etude Des Materiaux Organiques Pour Technologies Avances

Centre D'etudes Des Materiaux Organiques Pour Technologies Avancees

Guy Rabilloud

Bernard Sillion

Paul Mariaggi

Michel Senneron

Jean Malinge

Serge Gonzalez

Bernard Masson

Choua Cohen

Pierre Giuliani

Serge Gonzales

Gilbert Parrain

Paul Marriagi

Annie Dussart-Lermusiaux

Polyimide precursor compositions incorporating at least one compound of fula (1), at least one compound of formula (2), at least one compound of formula (3) and at least one compound of formula (4) ##STR1## in which one of the groups R.sup.3 and R.sup.4 represents a hydrogen atom and the other, in the same way as the groups R.sup.1 and R.sup.2, which can be the same or different, in each case represent a hydrocarbon group having 1 to 16 carbon atoms, m is a number between 5 and 20, n is an integer between 1 and 5 and R.sup.5 represents a hydrogen atom, a halogen atom, a hydrocarbon group with 1 to 16 carbon atoms, or a group of formula R.sup.6 --O-- in which R.sup.6 represents a hydrocarbon group having 1 to 16 carbon atoms. The preferred composition contains 30 to 70% by weight of dry matter of compounds of formulas (1), (2) and (3), in which the groups R.sup.1, R.sup.2 and one of the groups R.sup.3 and R.sup.4 is a methyl or ethyl group and the compound of formula (4) is benzyl alcohol. These compositions are usable as smoothing and/or protective coatings for metals, metal alloys or other substrates and in particular in the electrical and electronic industries, e.g. for the formation of dielectric films.

Polyimide precursor composition and application therefrom

Adhesive compositions are described comprising at least an arylaliphatic olyimide with ether chain formations, obtained by the polycondensation reaction of a tetracarboxylic aromatic acid or of one of its derivatives with at least two primary diamines, one of these diamines consisting of a polyether chain ending with the two amine functional groups and at least an epoxy resin possessing more than one epoxy group per molecular. These adhesive compositions can be used particularly for the gluing of films of polymers to thin metal sheets.

Method of gluing substrates using a composition comprising an

Expanded material obtained by heating a composition comprising at least one hermosetting nadimide resin, said heating being performed at a temperature and during a period which are sufficient to cause the expansion of said composition by release of cyclopentadiene. A nadimide resin of the polyimide type and having a number average molecular weight of 600 to 10,000 is preferably used. The composition further comprises preferably 1% to 50% by weight of a linear, preferably thermostable polymer.

Expanded materials with nadimide resin base

Polymer compositions comprising poly(benzhydrolimide) chains ending with ethylenic unsaturated groups complying with the general formula: ##STR1## wherein Ar is a divalent aromatic radical and R a hydrogen atom or a monovalent hydrocarbon radical. They can be prepared by reacting, under imidation condition, at least one primary diamine with at least one benzydrol 3,3', 4,4'-tetracarboxylic acid, a bis (ortho-acid-ester) or a tetraester of such acid and with an anhydride, an acid-ester or a diester of dicarboxylic cycloaliphatic acid with ethylenic unsaturation. These compositions may be converted to cross-linked polymides by thermal polyemrization. They can be used in particular for manufacturing composite materials, adhesives, molded articles and protective coatings withstanding high temperatures.

Polybenzhydrol compositions ending with ethylenic unsaturated groups,

Oligomer compositions of polyaryloxypyridine with acetylenic end groups are btained by formation of an oligomer composition of polyaryloxypyridine with halogenated end groups from an alkaline diphenolate and a dihalogenopyridine, followed with an ethynylation reaction. The average polycondensation degree may range from 1 to 50. Theses compositions can be used to form cross-linked lattices by polyaddition of the ethynyl groups.

Oligomer compositions of polyaryloxypyridines with acetylenic end

The disclosed compositions of polyaryloxypyridine oligomers with phthalonile end groups are obtained by formation of a composition of polyaryloxypyridine oligomers with alkali phenolate end groups, followed with the reaction of said composition with 4-nitrophthalonitrile. Their average polycondensation degree may range from 1 to 50. They can be used in combination with a co-reactant derived from benzhydrol and containing one or two ortho-dinitrile functional groups, to constitute polyaryloxypyridine co-polyphthalocyanine lattices.

Compositions of polyaryloxypyridine oligomers with phthalonitrile end

Aromatic polyimide compositions, useful in particular for manufacturing adhesive materials, varnishes and films withstanding high temperatures, having a high solubility in organic solvents, particularly polar solvents and which are manufactured by reacting, in such a solvent, a tetraester or diacid-diester of benzhydrol 3,3', 4, 4' tetracarboxylic acid with an aromatic diamine for a sufficient time to obtain a polycondensation reaction product having an inherent viscosity at 30.degree. C., at a concentration of 5 g/liter in N-methyl pyrrolidone, ranging from 0.1 to 2 dl/g.

Aromatic polyimide compositions of high solubility and their uses

Polyimide precursor compositions are described which may be prepared by rting a biprimary aromatic diamine with a diester-diacid or an aromatic tetraacid, and then with the substantially stoichiometrical complement of an aromatic dianhydride. The polyimide precursor compositions are used in the manufacture of insulating coatings, films, impregnating or enamelling varnishes for electric wires etc., and have excellent qualities of flexibility, adhesiveness and heat resistance.

Polyimide precursor compositions, their manufacture, the resultant

Aromatic polyimide compositions, precursors of copolyphthalocyanine-imides, heir manufacturing process and the resultant copolyphthalocyanine-imides, are described. These compositions may result for the reaction of 80.degree.-300.degree. C. of an aromatic tetra acid, diester-diacid, tetraester or dianhydride compound of formula: ##STR1## with an aromatic amino-dinitrile ##STR2## and optionally an aromatic diamine NH.sub.2 --Ar--NH.sub.2. A subsequent heating at 200.degree.-300.degree. C. provides, by cross-linking, copolyphthalocyanine-imides, which are hardened resins, stable at 250.degree.-300.degree. C. in continuous use.

Precursor of copolyphthalocyanine-imide lattice, preparation, and the

Bis (phenylglyoxyloyl) benzenes are manufactured by a method comprising the reaction of terephthalic or isophthalic aldehyde first with a low proportion of an alkali metal cyanide in a solvent, and then with benzaldehyde; the resultant product is oxidized to the desired bis (phenylglyoxyloyl) benzene.

Process for synthesizing bis (phenylglyoxyloyl)benzenes usable for

Enameling varnishes are made from particular polyarylquinoxaline resins; these resins comprise, in addition to arylquinoxaline groups, biphenylene or biquinoxalylene groups and their inherent viscosity at 30.degree. C. and 0.5 g/dl concentration in m-cresol is from 0.5 to 1.3 dl/g.

Thermosetting polyarylquinoxaline resins and their use, particularly in

Thermostable, infusible and insoluble polymer obtained by thermosetting aromatic oligomers of low molecular weight in the presence of an acid catalyst, said aromatic oligomers having an average molecular weight up to about 5000, a softening temperature from 80.degree. to 400.degree. C. and being obtained by separation from the reaction mixture produced by reacting meta-terphenyl with acetyl chloride and aluminum chloride.

Thermosetting aromatic resins and thermostable polymers derived therefrom

New tetracarbonyl compounds of the formulae: ##STR1## where R is a hydrogen atom, an alkyl radical or an aryl radical. The invention also contemplates the thermostable polymers obtained by reacting an aromatic tetra-amine with at least one of the above tetracarbonyl compounds.

Disubstituted meta-terphenyl compounds and resulting polymers

New aromatic compounds with ether functions particularly useful as power transmission fluids and as lubricants withstanding high temperatures, containing at least a major proportion of a compound of the formula: ##STR1## WHEREIN EACH Ar is selected from phenyl and metaphenoxy phenyl and optionally a minor proportion of at least one compound selected from those complying with the general formulas: ##STR2## WHEREIN Ar is defined as above.

Diaryloxy-meta-terphenyl derivatives, their manufacture and uses

New tetracarbonyl compounds of the formula ##STR1## where R is a hydrogen atom, an alkyl radical or an aryl radical. The invention also contemplates the thermostable polymers obtained by reacting an aromatic tetra-amine with at least one of the above tetracarbonyl compounds.

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Grenoble, France

Guy Rabilloud