Agilent Technologies, Inc.

Hewlett-packard Company

Micron Technology Incorporated

Geogolf, LLC

Guy R Wagner

Larry Joseph Koudele

Steven E Hanzlik

Bruce A Liikanen

Chandrakant D Patel

Arlen Lee Roesner

Gerald L Cadloni

John L Seabury

Michael A Hansen

Stephen P Van Aken

Abdlmonem H Beitelmal

Samuel Martin Babb

James Glenn Dowdy

John P Hoppal

Gustavo A Chavez

Donna E Ott

Dennis L Floyd

Guy Diemunsch

Veronica M Rodriguez

Stephen P VanAken

In one embodiment, an encoder reads a set of data from memory cells to obtain retrieved data influenced by one or more distortion mechanisms as a result of having been stored. A quality metric is generated responsive to the retrieved data that changes in value responsive to differences between the user data and the associated retrieved data. A quality monitor establishes a relationship between a current value of the quality metric and a threshold value and monitors the relationship as being indicative of a degradation of the quality of the retrieved data, and selectively initiates an error response. In another embodiment, a correction value is iterated through a set of values as a quality metric is monitored such that the value of the quality metric which most closely approaches the value of the quality metric immediately subsequent to an initial writing of the data can be selected.

Memory quality monitor based compensation method and apparatus

Monitoring of a golf ball and apparatus for doing so is described using differential time locating. Launch parameters of a golf ball can be characterized independent of any specific positional measurement on the basis of a ball signal that is transmitted from the ball. These parameters include initial spin, initial velocity, and initial trajectory. Ground proximity detection is described as well as a landing position and rollout position detection technique and associated apparatus. Calibration techniques are described for various kinds of range receivers that subsequently receive the ball signal.

Advanced golf monitoring system, method and components

A cooling device primarily for cooling, e.g., integrated circuits or other electronic devices during operation may include a heat sink portion having a plurality of cooling vanes and a heat pipe chamber. Both the cooling vanes and the heat pipe chamber may be integrally formed within the heat sink portion. Because the heat pipe chamber is integrally formed with the cooling vanes, no joints exist between the condensing surface of the heat pipe chamber and the cooling vanes. This, in turn, allows extremely rapid and efficient heat transfer between the heat pipe chamber and the cooling vanes. The cooling device may include extensions of the main heat pipe chamber which project into each of the cooling vanes. In this manner, the condensing surface of the heat pipe chamber is actually moved into the vanes at a position very close to the surface of the vanes where heat transfer into the atmosphere occurs.

Cooling apparatus for dissipating heat from a heat source

A heat sink comprises a core member comprising at least one core member first surface. The core member first surface is adapted to contact or be located adjacent at least a portion of the heat source. At least one outer peripheral surface is located on the core member. At least one cooling fin is operatively connected to the outer peripheral surface and extends in a direction substantially normal to the core member first surface. At least a portion of the outer peripheral surface is tapered, wherein the circumference of the outer peripheral surface in the proximity of the first surface is greater than the circumference of the outer peripheral surface not in the proximity of the first surface.

Cooling apparatus

A method for manufacturing a cooling device. The cooling device may be used to cool an integrated circuit. The method is broadly summarized by the following steps: pressing a metal slug to near-net shape, wherein the near-net shape includes a peripheral wall portion defining a chamber, the chamber having a first open end and a second closed end, the closed end defined by a chamber floor portion, and wherein the near-net shape includes a heat conductive base portion, the heat conductive base portion being defined by a lower base surface and the chamber floor portion; machining the lower base surface; creating a radius on the top of the peripheral wall portion; and cutting a plurality of slot openings in the peripheral wall portion.

Heat sink device manufacture

An assembly comprising a heat generating electronic device and a heat sink is provided with an intermediate gradient region between them. This intermediate region comprises a material having a coefficient of thermal expansion substantially matching the coefficient of thermal expansion of the heat generating electronic device, and a thermal conductivity greater than the thermal conductivity of the electronic device but less than the thermal conductivity of the heat sink. Provision of this intermediate layer substantially reduces stress on the electronic device caused by thermal cycling.

Thermally matched gradient heat sink

Cooling device

A cooling device includes a heat sink assembly that may also form a housing surrounding a chamber. The housing may be constructed of a plurality of cooling vanes which have elongated openings therebetween allowing air to pass between and cool the vanes. The cooling device operates in an extremely efficient manner, for example, by causing air to pass over the cooling vanes twice.

Cooling device and method

A heat sink comprises a core member comprising at least one first surface adapted to contact at least a portion of the heat source. An one outer peripheral surface is located on the core member. At least one cooling fin device comprising an inner peripheral surface and at least one cooling fin is adjacent the core member. In one embodiment, the inner peripheral surface of the cooling fin device is adjacent the outer peripheral surface of the core member. At least a portion of the outer peripheral surface is tapered, wherein the circumference of the outer peripheral surface in the proximity of the first surface is greater than the circumference of the outer peripheral surface not in the proximity of the first surface.

A removably mounted fan for an active heat sink, and the mounting of that combination to a part to be cooled, is obtained by: (1) The use a fan that engages and registers itself upon and against a top peripheral surface surrounding a cavity where the fan is to be located; (2) Holding the fan in place with one or more resilient mounting clips that span the distance from the top of the fan and an opposing outside bottom surface of the active heat sink; and, (3) Providing the resilient mounting clips with outward projecting mounting tabs that are flexible and resilient and that have mounting holes through which the resilient mounting clips (and the active heat sink they grip) can be attached to an assembly carrying the part to be cooled, such that the bottom of the active heat sink is in good thermal contact with that part.

Growing community of inventors

Loveland, CO, United States of America

Guy R Wagner