Rockwell Collins, Inc.

Guy N Smith

Alan P Boone

Brandon C Hamilton

An electromagnetic interference (EMI) shielded device and a method for making an EMI shield device are disclosed. The EMI shielded device may include an electrical circuit and an encapsulation layer disposed on a portion of the electrical circuit. The encapsulant layer having a plurality of particles dispersed therein, wherein the plurality of particles are suitable for shielding electrical circuitry from EMI. The method for making an EMI shielded device may include providing an electrical circuit, and depositing an encapsulant material upon a portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material. An additional method may include depositing a dielectric material upon a portion of the electrical circuit and depositing an encapsulant material upon a portion of the dielectric material and the portion of the electrical circuit, wherein a plurality of EMI shielding particles are dispersed within the encapsulant material.

Shielding encapsulation for electrical circuitry

An integrated circuit assembly (ex.&#x2014;a flip chip package, a wire bond chip package) is provided which includes a substrate (ex.&#x2014;a printed circuit board) and a die assembly. The die assembly includes an integrated circuit chip which is connected to the printed circuit board. Further, an external dielectric layer (ex.&#x2014;a solder mask layer) of the printed circuit board is at least substantially coated with a conductive coating (ex.&#x2014;a low sintering temperature, nano-particle silver coating). The conductive coating is not in contact with the die assembly and/or passive electronics which are connected to the printed circuit board, however the conductive coating is electrically connected to the printed circuit board. The conductive coating provides (ex&#x2014;acts as) an external ground plane for the printed circuit board.

PCB external ground plane via conductive coating

A method for protecting an electronic component including a semiconductor chip with a first elastic modulus includes steps as follows. At least one application of a first protective substance is applied on an outer surface of the semiconductor chip. The first protective substance has a second elastic modulus. A second substance is applied to an outer surface of the first protective substance. The second substance has a third elastic modulus. The second elastic modulus is substantially lower than the first elastic modulus and the third elastic modulus, and the first protective substance protects the semiconductor chip from damage during the application of the second substance and/or during the life of the semiconductor chip.

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Cedar Rapids, IA, United States of America

Guy N Smith