Loctite Corporation

Avery Products Corporation

Hughes Aircraft Company

Avery International Corporation

Gustav A Schmidt

Bernard Miles Malofsky

Martin Hauser

Maurice Douek

Robert S Miles

K Lim Wong

Two pieces (12 and 14) of material are releasably bonded together with a thermoplastic adhesive (28) in which a heating element (30) is embedded. After application, the adhesive (28) cures at ambient temperature or at a low elevated temperature produced by passing an electrical current through the heating element (30), to bond the pieces (12 and 14) together. The pieces (12 and 14) are debonded or separated by passing a relatively high electrical power through the heating element (30), to soften or melt the adhesive (28). A preferred adhesive (28) is a cyanoacrylate.

Structural bonding and debonding system

A three dimensional stack of printed circuit assemblies (10,12) provides electrical interconnection or bussing between layers of the stack by means of a composite contactor (34, 35, 36, 77, 79, 81, 83) formed of a shape-memory core (90) having a number of highly electrically conductive resilient wires (92, 94) wrapped around it. The shape-memory core (90) has a low temperature configuration that is substantially straight and enables the contactor assembly or core (90) and wires (92, 94) to be inserted into vias (30, 31, 76, 78, 80, 82) extending through this stack of layers with little or no insertion force. When heated above its phase change temperature, the shape-memory core (90) assumes a sinuous configuration which tightly presses the encircling conductive wires (92, 94) against the electrically conductive interior surfaces of the vias (30, 31) to provide mechanical and electrical contact from layer to layer.

Shape-memory metal core electrical contactor

A reinforced adhesive stock comprising a release liner on a carrier web and an adhesive layer in contact with the release liner. The adhesive layer comprises a mixture of an adhesive such as an anaerobic pressure-sensitive adhesive and a photopolymerizable compound. The photopolymerizable compound is capable of curing upon irradiating with actinic radiation. The adhesive layer contains strips of cured photopolymerizable compound which is cured by selectively irradiating with actinic radiation selective areas in strips within the adhesive layer. The resulting form strips of cured polymers provide a reinforcement to the adhesive layer inhibiting flow of the adhesive from the release liner. Additionally, the cured polymer strips provide added cohesive strength to the adhesive layer. A method of forming such adhesive stock is also disclosed.

Reinforced adhesive tapes

There is provided a curable anaerobic pressure sensitive adhesive composition, a mixture of a curable anaerobic system and a high molecular weight polymer system. The mixture which may include a tackifier and other functional additives constitutes a pressure sensitive adhesive and exhibits elastomeric properties. There is also provided in the composition an initiator systemnecessary to permit curing of the anaerobic pressure sensitive composition upon activation by the exclusion of oxygen. One or more accelerators for cure may also be provided. In one embodiment a component of the catalyst system may be either absent and provided later or latently present in microspheres which upon rupture will enhance the curing operation.

Anaerobic pressure sensitive adhesive composition

There is provided a curable anaerobic pressure sensitive adhesive composition, a mixture of a curable anaerobic system and a high molecular weight polymer system. The mixture which may include a tackifier and other functional additives constitutes a pressure sensitive adhesive and exhibits elastomeric properties. There is also provided in the composition an initiator system necessary to permit curing of the anaerobic pressure sensitive composition upon activation by the exclusion of oxygen. One or more accelerators for cure may also be provided. In one embodiment a component of the catalyst system may be either absent and provided later or latently present in microspheres which upon rupture will enhance the curing operation.

There are provided curable anaerobic pressure sensitive adhesive stocks in the form of sheets and tapes in which the adhesive is contained between two differential release surfaces. This construction permits total pressure sensitive adhesive transfer to a substrate which is to be firmly secured to another substrate upon the exclusion of oxygen and initiation of cure of the anaerobic resin. The compositions are those, based on the total weight of the composition, containing from about 4 to about 40 percent by weight of a first anaerobic resin having a viscosity up to about 1000 cps at 25.degree. C from 0 to about 80 percent by weight of a second anaerobic resin having a viscosity greater than about 1000 cps at 25.degree. C, from about 9 to 95 percent by weight of a thermoplastic resin system, from 0 to about 10 percent of a latent accelerator and about 0.1 to about 10 percent of a hydroperoxide catalyst, the composition having static shear at 0.25 in.sup.2 at a load of 250 gram greater than 10 minutes, a Polyken tack of greater than 700 grams, a loop tack greater than 1.5 lbs/in.sup.2 and a 180.degree. peel greater than 2 lbs. An external primer may be provided to accelerate cure.

Anaerobic pressure sensitive adhesive stocks

There are provided curable anaerobic pressure sensitive adhesive stocks in the form of sheets and tapes in which the adhesive is contained between two differential release surfaces. This construction permits total pressure sensitive adhesive transfer to a substrate which is to be firmly secured to another substrate upon the exclusion of oxygen and initiation of cure of the anaerobic resin. The adhesive layer provided may be homogeneous or heterogeneous, and there may be contained within the adhesive layer a support layer. The release liner employed is preferably impervious to migration of contained compounds which serve as the accelerators for cure of the curable anaerobic resin.

Growing community of inventors

South Pasadena, CA, United States of America

Gustav A Schmidt