Sandisk Information Technology (shanghai) Co., Ltd.

Gursharan Singh

Hem P Takiar

Chin Tien Chiu

C C Liao

Cheeman Yu

Wei Gu

Zhong Lu

Fisher Yu

Tiger Tai

Ken Qian

The present technology relates to a semiconductor package. The semiconductor package comprises: a first component comprising a plurality of first dies stacked on top of each other, each of first dies comprising at least one side surface and an electrical contact exposed on the side surface, and the plurality of first dies aligned so that the corresponding side surfaces of all first dies substantially coplanar with respect to each other to form a common sidewall; a first conductive pattern formed over the sidewall and at least partially spaced away from the sidewall, the first conductive pattern electrically interconnecting the electrical contacts of the plurality of first dies; at least one second component; and a second conductive pattern formed on a surface of the second component, the second conductive pattern affixed and electrically connected to the first conductive pattern formed over the sidewall of the first component.

Semiconductor package and method of fabricating semiconductor package

The present technology relates to a semiconductor device. The semiconductor device comprises: a plurality of dies stacked on top of each other, each of the dies comprising a first major surface, an IO conductive pattern on the first major surface and extended to a minor surface substantially perpendicular to the major surfaces to form at least one IO electrical contact on the minor surface, and the plurality of dies aligned so that the corresponding minor surfaces of all dies substantially coplanar with respect to each other to form a common flat sidewall, and a plurality of IO routing traces formed over the sidewall and at least partially spaced away from the sidewall. The plurality of IO routing traces are spaced apart from each other in a first direction on the sidewall, and each of IO routing traces is electrically connected to a respective IO electrical contact and extended across the sidewall in a second direction substantially perpendicular to the first direction on the sidewall.

Semiconductor device

A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device.

High yield semiconductor device

Growing community of inventors

Fremont, CA, United States of America

Gursharan Singh