Agilent Technologies, Inc.

Other

Avago Technologies General IP (singapore) Pte. Ltd.

Aptina Imaging Corporation

Avago Technologies Limited

Avago Technologies Sensor IP (singapore) Pte. Ltd

Gurbir Singh

Sai Mun Lee

Chee Keong Chong

Ak Wing Leong

Boon Kheng Lee

Kee Siang Goh

Poh Huat Lye

Kee Yean Ng

Yee Loong Chin

Cheng Why Tan

Seong Choon Lim

Huck Khim Koay

Shazli Husni

Lee Sai Mun

Sundar A L Natarajan Yoganandan

Seow Piang Joon

Lee Saimun

Chin Yee Loong

Yee Long Chin

A compact flexible camera lens barrel designed for use with mobile telephones. The lens barrel may be used separately or in conjunction with a camera housing. The lens barrel is designed for use with a variety of different components including cover glass, cover plastics, flanges, gaskets and the like. The components do not affect the original z-height of the lens barrel.

Flexible camera lens barrel

In one embodiment an electronic device, such as an optical sensor, is attached to a substrate upon which wire logouts and, if desired, other components are constructed. A frame, or cover, is attached to the substrate surrounding the attached device. An aperture in the cover allows wireless signals to pass in or out of the cover.

System and method for mounting electrical devices

A light emitting diode, a reflector and a platform are employed within a light source. The light emitting diode emits light exclusively from its side surfaces. The reflector has a parabolic reflective surface that collimates any portion of the light reflecting from the parabolic reflective surface. The platform supports a centering of the light emitting layer(s) of the light emitting diode on a focus point of the parabolic reflective surface.

Light emitting diode based light source emitting collimated light

A leadless optical electronic package includes a lead frame having a die-attach pad and a plurality of leadless connection pads encapsulated in and extending through an encapsulation defining a planar mounting surface that can be soldered directly to a circuit board. The die-attach pad and connection pads define internal surfaces that remain partially exposed through the encapsulation. The internal surfaces are for attaching an electronic die and making electrical connections between the die and the connection pads. A die mounted on the die-attach pad is cooled more effectively and efficiently than dice in prior optical electronic packages. The leadless connection pads reduce the footprint and height of the package compared with prior optical electronic packages. The encapsulation is adapted for receiving a cover having a cover glass to allow light to pass though the cover and illuminate the die. The cover is adapted to receive an optics component for projecting light through the cover glass onto the die.

Leadless leadframe electronic package and sensor module incorporating same

An optical navigation sensor apparatus for an optical mouse includes an optical navigation sensor having an electronic chip, an aperture plate and an imaging lens integrated into a single package. The imaging lens includes a lens housing surrounding the aperture and providing a barrier to the entry of foreign matter into the aperture. In one form, the optical navigation sensor also includes a light emitting diode (LED) for illuminating a small area of a surface under the sensor and generating a reflected image that is detected by the electronic chip. In a sensor having an integral LED, an integral collimating lens is included for receiving light from the LED and focusing the light from the LED on the surface to be illuminated. The collimating lens is incorporated into a lens housing surrounding the LED and protecting the LED from exposure to foreign material.

Optical navigation sensor with integrated lens

A surface mountable electronic device includes a body with a first surface for mounting the device. The first surface has recessed portions therein. Electrical contacts are provided in the first surface. The electrical contacts include first portions that form at least a portion of at least one inner surface of said recessed portions.

Surface mountable electronic device

A high resolution optical encoder with an angular collimated light beam. The optical encoder includes a source, a collimator, a reflective surface and a receiver. The light beam is collimated using a collimator and/or source at an angle to the plane of the reflective surface.

High resolution optical encoder with an angular collimated light beam

A method of interconnecting bond pads on a semiconductor die to leads of a package is disclosed. The method includes placing a connector over each bond pad and its corresponding lead. The connector is one of a plurality of ganged connectors. The method also includes electrically connecting the connector to the bond pad and the lead and singularizing the connector from the plurality of ganged connectors. Such a method of interconnection has the advantage of simultaneously interconnecting multiple bond pads to leads. In a preferred embodiment, light-emitting diodes (LEDs) are manufactured using the method. A PCB is etched to produced lead pairs of the LEDs. A semiconductor die is attached to a first lead of each lead pair. Ganged interconnects are aligned with and tagged onto the dies and the second leads of the lead pairs, thereby electrically connecting them. After tagging, the interconnects are singularized. An encapsulant is applied on each die and interconnect. Each die, interconnect and lead pair are then separated to form individual LEDs.

Method of interconnecting an electronic device

Growing community of inventors

Penang, Malaysia

Gurbir Singh