Lenovo (beijing) Limited

Beijing Lenovo Software Ltd.

Guowen Zhang

Yue Liu

Qian Zhao

Tianshui Tan

Yizhi Shi

An electronic apparatus includes a retractable module, a flexible module, and a control module. The retractable module includes a first retractable structure and a second retractable structure that are connected to each other. The flexible module includes a vibration film and a one-way valve connected to the vibration film. The vibration film includes a first state and a second state. The control module is configured to control the vibration film to enter the second state from the first state in response to the first retractable structure being away from the second retractable structure and perform heat dissipation on the electronic apparatus through the vibration film and the one-way valve in the second state.

Electronic apparatus

A heat dissipation device for an electronic device is provided. The heat dissipation device comprises a heat conducting cover configured to be disposed on an electronic device, the heat conducting cover forming a closed cavity; and a heat absorbing material filler located within the closed cavity as defined by the heat conducting cover. With a temperature increase of the electronic device, the heat absorbing material filler is configured to deform structurally, to absorb heat generated by the electronic device.

Heat dissipation device and method, and electronic device

An electronic device according to the invention includes a second electronic device and a first electronic device removably connected with the second electronic device; the electronic device includes a first heat dissipation channel in the first electronic device and a second heat dissipation channel in the second electronic device. In a disconnected state, the heat dissipation airflow flows through the first heat dissipation channel to perform heat dissipation of the first electronic device. In a connected state, the first air inlet of the first heat dissipation channel communicates with the second air outlet of the second heat dissipation channel, and the heat dissipation airflow may enter into the first heat dissipation channel via the second heat dissipation channel so as to perform heat dissipation of the first electronic device by the second heat dissipation channel and the first heat dissipation channel.

Electronic device, first and second electronic device thereof, and method for switching first electronic device

An electronic apparatus includes: a case; a support device arranged at the case; a rotating plate articulated to the support device; a driving device; and a heat generating device. The driving device is configured to drive the rotating plate to rotate with respect to the support device; the rotating plate rotates with respect to the support device to generate airflow, the airflow is in a direction parallel to a rotation plane of the rotating plate and away from the support device; and the heat generating device is arranged at a region that the airflow flows through and heat of the heat generating is dissipated by the airflow.

Electronic device

Embodiments of the present disclosure refers to an electronic device, comprising a first bracket that is made of a first material having a thermal conductivity greater than a first threshold and has therein at least one passage including a chamber; wherein the first bracket and the chamber define a closed space in which a cooling medium having a thermal conductivity greater than a second threshold is able to circulate; and wherein the chamber is provided with a driving body at at least one side wall of the chamber and the driving body is deformable under a perdetermined condition to change a capacity of the chamber so as to drive the cooling medium to flow.

A control method and an electronic device are disclosed in the application. The control method is applied to an electronic device including a CPU. The method includes: obtaining a current state of the electronic device; judging whether the current state is a first or a second state; generating a first control instruction in the case that the current state is the first state, or generating a second control instruction in the case that the current state is the second state; performing the first control instruction to control the operating frequency of the CPU within the first maximum operating frequency or performing the second control instruction to control the operating frequency of the CPU within the second maximum operating frequency. Enabling to regulate the maximum operating frequency of the CPU adaptively based on the current state of the electronic device.

Growing community of inventors

Beijing, China

Guowen Zhang