Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Other

Air Products and Chemicals, Inc.

Guoqiang Wang

Zhanfeng Cao

Yingwei Liu

Zhiwei Liang

Qingzhao Liu

Guangcai Yuan

Ke Fei Wang

Zhongyuan Sun

Jinxiang Xue

Muxin Di

Wenqi Liu

Shuilang Dong

Jiushi Wang

Qi Yao

Renquan Gu

Ke Wang

Kai Sui

Wenqian Luo

Xue Dong

Zhijun Lv

Haixu Li

Xinhong Lu

Xiaoxin Song

Huijuan Wang

Jingkai Ni

Xiaoyan Zhu

Chao Dong

Xiaolei Zhang

Wei Wang

Rui Huang

Jianguo Wang

Qi Qi

Xiang Sean Zhou

Hua Yin Huang

Haifeng Hu

Pengxia Liang

Zheng Fang

Peng Xu

Song Liu

Lizhong Wang

Yanliu Sun

Ting Zeng

Shiyu Zhang

Song Yang

Zhao Cui

Huan Liu

Yichi Zhang

Yujie Liu

Jian Yang

Yu Jiang

Jiahui Han

Ge Shi

Shunhang Zhang

Huili Wu

Yuyao Wang

Xiaofen Wang

Dapeng Xue

Yan Qu

Hsuanwei Mai

Peng Jin

Che An

Yongfei Li

Meina Yu

Weiwei Chu

Da Lu

Qi Gao

Heren Gui

Wanru Dong

Lucien Zalman

He Luo

Xiaoxuan Hu

Huawei Ma

Wei Xia

Xiang Zhou

Puze Wang

Yanbo Peng

Ruimin Li

Tingxi Liu

Yinglan A

Chii-King Wong

An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer. The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.

Array substrate and manufacturing method therefor, display panel, and backlight module

Disclosed is a flexible display substrate, including: a substrate base layer, peripheral side edges of the substrate base layer having a first stepped structure having a process performance, the first stepped structure being configured to enable a film layer covering the first stepped structure to be easily broken at the stepped structure when a force is applied; a functional layer provided on the substrate base layer and exposed to the outside of the first stepped structure; and an inorganic encapsulation layer covering side edges of the functional layer and extending to the first stepped structure of the side edges of the substrate base layer.

Flexible display substrate and manufacturing method therefor, and display device

Embodiments of the present disclosure provide an intermediate substrate, including: a first substrate; a black photoresist layer on a side of the first substrate; and a plurality of light emitting devices on a side of the black photoresist layer away from the first substrate. Each of the plurality of light emitting devices has a light-exiting side for emergence of light emitted by the light emitting device, the light-exiting side is in contact with the black photoresist layer, and the light emitting device includes a driving electrode for introducing a driving signal.

Intermediate substrate and fabrication method of display panel

An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

Array substrate, display apparatus, and method of fabricating array substrate

The present disclosure relates to a display substrate, a display device, and a method for manufacturing a display substrate. The display substrate includes a base substrate having a first side and a second side opposite to the first side, a via provided in the base substrate, a thin film transistor provided on the first side of the base substrate, a first conductive structure provided on the first side of the base substrate, wherein a first sub-portion of the first conductive structure is located in the via, and wherein a material of the first conductive structure is the same as a material of a source/drain electrode of the thin film transistor.

Display substrate, display device and method for manufacturing a display substrate

Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.

Display backplate and method for manufacturing same, display panel and method for manufacturing same, and display device

The present disclosure provides a driving substrate and a manufacturing method thereof, and a micro LED bonding method. The driving substrate includes: a base substrate; a driving function layer provided on the base substrate, and including a plurality of driving thin film transistors and a plurality of common electrode lines; a pad layer including a plurality of pads provided on a side of the driving function layer away from the base substrate, each pad including a pad body and a microstructure of hard conductive material provided on a side of the pad body away from the base substrate; and a plurality of buffer structures provided on the side of the driving function layer away from the base substrate, each buffer structure surrounding a portion of a corresponding microstructure close to the base substrate, and a height of the buffer structure being lower than a height of the microstructure.

Driving substrate and manufacturing method thereof, and micro LED bonding method

A display substrate has at least one display region and at least one non-display region, and a non-display region is located at at least one side of a display region. The display substrate includes a base, a plurality of light-emitting devices, and an encapsulation layer. The plurality of light-emitting devices are located in the at least one display region and disposed on a side of the base. The encapsulation layer is disposed on a side of the plurality of light-emitting devices facing away from the base, and configured to encapsulate the plurality of light-emitting devices. A surface, proximate to the base, of a portion of the encapsulation layer located in the non-display region is unevenly arranged.

Display substrate and display device

A display panel includes a base; a plurality of display units disposed on a surface of the base, every two adjacent display units being provided with a gap therebetween; and a connection unit disposed in the gap and connected to the every two adjacent display units. The connection unit includes a first organic layer, a conductive layer and a second organic layer that are sequentially stacked. The first organic layer and the second organic layer are each configured to block stress causing the connection unit to deform.

Display panel and method for manufacturing the same, and display device

A display assembly, includes: a first substrate and a second substrate that are disposed opposite, a first liquid crystal layer located between the first substrate and the second substrate, a third substrate disposed at a side of the first substrate away from the second substrate, a second liquid crystal layer located between the first substrate and the third substrate, a first pixel circuit layer disposed between the first substrate and the first liquid crystal layer, a second pixel circuit layer disposed between the third substrate and the second liquid crystal layer, a polarizing device disposed on a side of the second pixel circuit layer away from the second liquid crystal layer, and a first metal wire grid polarizing layer disposed between the first substrate and the first pixel circuit layer. The first metal wire grid polarizing layer is electrically insulated from the first pixel circuit layer.

Display assembly and display apparatus

An array substrate includes a substrate, a protection layer, and a photodiode. The protection layer is disposed over the substrate, has a single layer-structure, and is provided with a through-hole therein. The photodiode includes a lower electrode, a PN junction and an upper electrode, which are sequentially over the substrate. The PN junction is within the through-hole. The protection layer and the PN junction of the photodiode have a substantially same thickness. The array substrate further includes a thin-film transistor over the substrate. An orthographic projection of an active layer of the thin-film transistor on the substrate does not overlap with an orthographic projection of the PN junction of the photodiode on the substrate.

Array substrate, manufacturing method thereof, and display apparatus

An array substrate and a method for manufacturing the same, a method and assembly for detecting light, and a display device are provided. The array substrate includes: a base substrate having a pixel region; a light detecting unit, a switch unit, and a light emitting unit that are located in the pixel region, where the light emitting unit and the light detecting unit share the switch unit.

Array substrate and method for manufacturing the same, method and assembly for detecting light, and display device

A PIN device includes: a first doped layer, a second doped layer, and an intrinsic layer between the first doped layer and the second doped layer, where the second doped layer includes a body portion and an electric field isolating portion at least partially enclosing the body portion; and the electric field isolating portion is doped differently from the body portion.

Pin device and manufacturing method thereof, photosensitive device and display device

Growing community of inventors

Beijing, China

Guoqiang Wang