3M Innovative Properties Company

Guoping Mao

Olester Benson, Jr

Rui Yang

Robert J DeVoe

Patrick R Fleming

Naiyong Jing

Moses Mekala David

Kurt J Halverson

Raymond Patrick Johnston

Robert Steven Clough

Jun-Ying Zhang

Raymond J Kenney

David Adams Ender

Nicholas A Stacey

George Van Dyke Tiers

Tzu-Chen Lee

Jennifer J Sahlin

Jaime B Willoughby

Nanayakkara L D Somasiri

Terry Lee Smith

Zai-Ming Qiu

Catherine A Leatherdale

Alfred Viehbeck

Yu Yang

Alphonsus V Pocius

Dipankar Ghosh

Fuming B Li

David H Redinger

Xiaoguang Sun

James Craig Novack

Michael E Griffin

Justine A Mooney

Harvey Kalweit

Shane Shanhong Mao

Robert J Devoe

John B Scheibner

Nathan P Kreutter

Nelson B O'Bryan

Dennis M Brunner

Ji-Hwa Lee

Michael S Graff

Michael W Bench

Stephen J Znameroski

David L Buster

Shichun Qu

Daniel K Luebbert

Hany B Eitouni

Seungbae Min

Olester Benson

A passive electrical article including a dielectric layer having a nonwoven material.

Passive electrical article

The disclosure provides microstructured articles and methods useful for detecting an analyte in a sample. The articles include microwell arrays. The articles can be used with an optical system component in methods to detect or characterize an analyte.

Microwell array articles and methods of use

A method of forming a working mold including placing a substrate near an electrode in a chamber, the substrate () having at least a first structured surface (); providing power to the electrode to create a plasma, &#x2014;introducing vapor of liquid silicone molecules into the plasma; and depositing a release layer (), the release layer () including a silicone containing polymer, the release layer () being deposited on at least a portion of the first structured surface of the substrate to form the working mold.

Methods of forming molds and methods of forming articles using said molds

Lightguides, devices incorporating lightguides, processes for making lightguides, and tools used to make lightguides are described. A lightguide includes light extractors arranged in a plurality of regions on a surface of the lightguide. The orientation of light extractors in each region is arranged to enhance uniformity and brightness across a surface of the lightguide and to provide enhanced defect hiding. The efficiency of the light extractors is controlled by the angle of a given light extractor face with respect to a light source illuminating the light guide.

Light guides having enhanced light extraction

A method of forming a working mold including: placing a substrate () on an electrode in a chamber, the substrate having at least a first structured surface () and the substrate including a thermoset polymeric material; introducing a release () layer forming gas into the chamber, wherein the release layer forming gas includes silicon containing gas and oxygen gas in an atomic ratio of not greater than about 200; providing power to the electrode to create a plasma of the release layer forming gas within the chamber; and depositing a release layer formed from the release layer forming gas on at least the first structured surface of the substrate to form a working mold.

In one embodiment, a semiconductor component, such as a wavelength converter wafer, is described wherein the wavelength converter is bonded to an adjacent inorganic component with a cured bonding layer comprising polysilazane polymer. The wavelength converter may be a multilayer semiconductor wavelength converter or an inorganic matrix comprising embedded phosphor particles. In another embodiment, the semiconductor component is a pump LED component bonded to an adjacent component with a cured bonding layer comprising polysilazane polymer. The adjacent component may the described wavelength converter(s) or another component comprised of inorganic material(s) such as a lens or a prism. Also described are methods of making semiconductor components such as wavelength converters and LED's.

Light emitting diode component comprising polysilazane bonding layer

An assembly includes a dielectric layer in contact with a semiconductor layer. The dielectric layer includes a crosslinked polymeric material having isocyanurate groups, wherein the dielectric layer is free of zirconium oxide particles. The semiconductor layer includes a non-polymeric organic semiconductor material, and is substantially free of electrically insulating polymer. Electronic components and devices including the assembly are also disclosed.

Assembly and electronic devices including the same

A novel etching agent for etching II-VI semiconductors is provided. The etching agent includes an aqueous solution of potassium permanganate and phosphoric acid. This etching solution can etch II-VI semiconductors at a rapid rate but tend to be much less reactive with III-V semiconductors. The provided agent can be used in a method for etching II-VI semiconductors.

Wet etching agent for II-VI semiconductors and method

A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.

Dielectric composite material

Provided are partially etched dielectric films with raised conductive features. Also provided are methods for forming the raised conductive features in the dielectric films, which methods include partially etching the dielectric films.

Partially etched dielectric film with conductive features

A process for providing a metal-seeded liquid crystal polymer comprising the steps of providing a liquid crystal polymer substrate to be treated by applying an aqueous solution comprising an alkali metal hydroxide and a solubilizer as an etchant composition for the liquid crystal polymer substrate. Further treatment of the etched liquid crystal polymer substrate involves depositing an adherent metal layer on the etched liquid crystal polymer substrate. An adherent metal layer may be deposited using either electroless metal plating or vacuum deposition of metal such as by sputtering. When using electroless metal plating, a tin(II) solution applied to the liquid crystal polymer provides a treated liquid crystal polymer substrate to which the application of a palladium(II) solution provides the metal-seeded liquid crystal polymer. The etchant composition comprises a solution in water of from 35 wt. % to 55 wt. % of an alkali metal salt, and from 10 wt. % to 35 wt. % of a solubilizer dissolved in the solution to provide the etchant composition suitable for etching the liquid crystal polymer at a temperature from 50&#xb0; C. to 120&#xb0; C. A flexible circuit comprising a liquid crystal polymer film having through-holes and related shaped voids may be formed using etchant compositions as previously described.

Liquid crystal polymers for flexible circuits

Method of fabricating an optical element. A photodefinable composition is provided that includes (i) a hydrophobic, photodefinable polymer, said photodefinable polymer having a glass transition temperature in the cured state of at least about 80&#xb0; C.; and (ii) a multiphoton photoinitiator system comprising at least one multiphoton photosensitizer and preferably at least one phtoinitiator that is capable of being photosensitized by the photosensitizer. One or more portions of the composition are imagewise exposed to the electromagnetic energy under conditions effective to photodefinably form at least a portion of a three-dimensional optical element.

Microfabrication of organic optical elements

A supported catalyst is provided comprising catalyst metal nanoparticles having an average particle size of 3.0 nm or less, or more typically 2.0 nm or less, and typically having a standard deviation of particle size of 0.5 nm or less, which are supported on support particles at a loading of 30% or more. Typical catalyst metals are selected from platinum, palladium, ruthenium, rhodium, iridium, osmium, molybdenum, tungsten, iron, nickel and tin. Typical support particles are carbon. A method of making a supported catalyst is provided comprising the steps of: a) providing a solution of metal chlorides of one or more catalyst metals in solvent system containing at least one polyalcohol, typically ethylene glycol containing less than 2% water; b) forming a colloidal suspension of unprotected catalyst metal nanoparticles by raising the pH of the solution, typically to a pH of 10 or higher, and heating said solution, typically to 125 &deg; C. or higher; c) adding support particles to the colloidal suspension; and d) depositing the unprotected catalyst metal nanoparticles on the support particles by lowering the pH of said suspension, typically to a pH of 6.5 or lower.

Supported nanoparticle catalyst

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Woodbury, MN, United States of America

Guoping Mao