Dynea Chemicals Oy

Neste Resins Canada

Neste Chemicals Oy

Dynea Canada Ltd.

Guomin Bian

Kwok Tang

Yuzhuo Li

Leena Matilainen

Krishnayya Cheemalapati

Sinikka Ingelin

Wu Li

Claude Ostiguy

Kari Leskinen

John Westbrook

Rick Cheng

Leina Chan

Vivek Duvvuru

Yong Lin

Matti Satuli

Atanu Roy Chowdhury

Deenesh Bundi

Joe Zunzi Zhao

Henry Bian

An abrasive composition comprising composite non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The composite particles individually contain at least one nonpolymeric organic component and at least one other chemical component different from the at least one nonpolymeric organic component. The slurry composition can be vastly simplified if one or more of the components are incorporated into the abrasive particles. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.

Engineered non-polymeric organic particles for chemical mechanical planarization

An abrasive composition comprising non-polymeric organic particles that is useful for chemical mechanical planarization (CMP), and which can widely be used in the semiconductor industry. The inventive compositions preferably comprise soft water in combination with 0.001&#x2013;20 w/w % of non-polymeric organic particles, 0.1&#x2013;10 w/w % of an oxidizing agent, 0.05&#x2013;10 w/w % of a chelating agent, 0.01&#x2013;10 w/w % of a surfactant, and 0&#x2013;10 w/w % of a passivation agent at a pH in the range of 2&#x2013;12, wherein said percentages are w/w (weight/weight) percentages, based on the total weight of said compositions. The abrasive compositions provide an efficient polishing rate, excellent selectivity and good surface quality when utilized as a new abrasive composition in CMP applications.

Non-polymeric organic particles for chemical mechanical planarization

The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.

Abrasive composition containing organic particles for chemical mechanical planarization

A one-step, in-situ, process for producing a high solids content emulsion or dispersion of partially or totally crosslinked urea formaldehyde (UF), melamine formaldehyde (MF), or melamine urea formaldehyde (MUF) resin droplets or particles, by forming a reaction mixture of (i) aqueous formaldehyde (formalin), (ii) at least one water-soluble protective colloid, (iii) water and (iv) optionally a surfactant, and mixing the reaction mixture in a reaction vessel; optionally adjusting the initial pH of the reaction mixture according to a desired value as needed; adding (i) urea or substituted urea, (ii) melamine or substituted melamine, or (iii) a mixture thereof, to the reaction mixture; and heating the reaction mixture to a temperature at which condensation takes place between the (i) urea or substituted urea, (ii) the melamine or substituted melamine, or (iii) the mixture thereof, and the formaldehyde to form a urea formaldehyde, melamine formaldehyde or melamine urea formaldehyde resin, and holding the reaction mixture at that temperature or a higher temperature, under mixing, for a period of time sufficient to achieve a desired degree of crosslinking in said urea formaldehyde, melamine formaldehyde or melamine urea formaldehyde resin; and cooling the reaction mixture. The droplet or particle size of the resulting resin dispersion can be controlled and adjusted by way of the present technique to the application requirements.

Method of preparing co-polymer particles

Method for the manufacture of a phenolic resin emulsion and/or dispersion, wherein an aldehyde, a phenolic compound and an alkaline catalyst are allowed to react at a temperature of 40-100&deg; C. until a desired degree of condensation is achieved, and the pH of the resin is adjusted to a value below 9 using an acid in the presence of a surface active agent or a mixture thereof at a temperature below 100&deg; C. and a phenolic resin emulsion and/or dispersion is obtained providing a colorless or light-colored glue line or surface when cured.

Method for the preparation of polymers

A one-step, in-situ, process for producing a high solids content emulsion or dispersion of partially or totally crosslinked urea formaldehyde or melamine formaldehyde resin droplets or particles, by forming a reaction mixture of (i) aqueous formaldehyde (formalin), (ii) at least one water-soluble protective colloid, (iii) water and (iv) optionally a surfactant, and mixing the reaction mixture in a reaction vessel; optionally adjusting the initial pH of the reaction mixture according to a desired value as needed; adding (a) urea, substituted urea, or a mixture thereof, or (b) melamine, substituted melamine, or a mixture thereof, to the reaction mixture; and heating the reaction mixture to a temperature at which condensation takes place between the (a) urea, substituted urea, or the mixture thereof, or (b) melamine substituted melamine, or the mixture thereof, and the formaldehyde to form a urea formaldehyde or melamine formaldehyde resin, and holding the reaction mixture at that temperature or a higher temperature, under mixing, for a period of time sufficient to achieve a desired degree of crosslinking in said urea formaldehyde or melamine formaldehyde resin; and cooling the reaction mixture. The droplet or particle size of the resulting resin dispersion can be controlled and adjusted by way of the present technique to the application requirements.

Growing community of inventors

Toronto, Canada

Guomin Bian