Boe Technology Group Co., Ltd.

Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Guohua Wang

Yan Chen

Fei Gao

Wenming Ren

Xing Su

The present disclosure provides a method and an apparatus for mass transfer of Micro LEDs. In one embodiment, the method comprises: providing Micro LED chips; dumping at one time Micro LED chips onto a transfer surface of a transfer mold, the transfer surface being formed with transfer cavities; and vibrating the transfer mold to cause the Micro LED chips to fall into shape-matched transfer cavities respectively, and tilting the transfer mold so that the Micro LED chips that have not fallen into the transfer cavities leave the transfer surface.

Method and apparatus for mass transfer of micro LEDs

The present disclosure relates to a method of preparing a display substrate. The method may include forming a pattern layer on a base substrate; forming a planarization layer on the pattern layer, the planarization layer comprising a host material and a hydrophilic material and a hydrophobic material mixed in the host material; treating the planarization layer so that the host material reacts with the hydrophilic material to form a hydrophilic polymer, the host material reacts with the hydrophobic material to form a hydrophobic polymer, and the planarization layer is delaminated to form a first sub-planarization layer and a second sub-planarization layer; and cleaning the planarization layer with a cleaning solution that reacts with the hydrophobic polymer to remove at least part of the first sub-planarization layer. The first sub-planarization layer includes the hydrophobic polymer, and the second sub-planarization layer includes the hydrophilic polymer.

Method for manufacturing a display substrate comprising forming a planarization layer having a hydrophilic material and a hydrophobic material mixed in a host material, display substrate, and display apparatus

An array substrate includes a display region and a wiring region. The wiring region includes a plurality of sets of signal line leads and a plurality of wiring regions, and a same set of signal line leads extends to a same bonding region disposed in the wiring region. The wiring region further includes at least one auxiliary wiring structure. Each auxiliary wiring structure is disposed between adjacent two sets of signal line leads and includes a peripheral closed wiring loop. Each peripheral closed wiring loop includes a plurality of corner portion, and a shape of at least one corner portion proximate to the display region is a curve.

Growing community of inventors

Beijing, China

Guohua Wang