Other

Shanghai Yaochuan Information Technology Co., Ltd.

Xerafy Ltd (bvi)

Zhijia Liu

Guohong Du

The present disclosure relates to an ultrahigh frequency tag antenna based on fractal processing comprising a substrate (), a radiation plate () and a substrate base plate (). The radiation plate () has a first radiation oscillator unit () and a second radiation oscillator unit (). A chip () is coupled between the first radiation oscillator unit () and the second radiation oscillator unit (). Each of the first radiation oscillator unit () and the second radiation oscillator unit () has a fractal structure.

Ultra high frequency tag aerial based on fractal processing

The present invention relates to a RFID tag antenna with ultra-thin dual-frequency micro strip patch antenna array, the RFID tag antenna comprises an units array (), a substrate () and a substrate base plate (); the radiation units array () is configured to be asymmetrically distributed around a chip; a first radiation unit () and a third radiation unit () form a low-frequency resonant system of the RFID tag antenna (), and a second radiation unit () and a fourth radiation unit () form a high-frequency resonant system of the RFID tag antenna (), thereby achieving a dual-frequency effect, and enabling the RFID tag antenna of the present disclosure to be compatible with both of the working frequency bands in Europe and in U.S., and thus achieving a dual-frequency-band property.

RFID tag aerial with ultra-thin dual-frequency micro strip patch aerial array

A production process of a tag antenna and a micro strip patch RFID tag antenna. The production process includes: an etching step of etching a metal layer on a thin film material composited with the metal layer to form a thin film () with radiation unit patterns (), short circuit pin patterns () and ground plate patterns (); a compositing step of coating gel on the thin film () or a substrate () and adhering the thin film () to the substrate (); and a folding step of folding the thin film () along an edge of the substrate (), adhering the short circuit pin patterns () of the thin film () to sides of the substrate (), folding again the thin film () in a same direction, adhering the ground plate patterns () to a lower surface of the substrate ().

Growing community of inventors

Chengdu, China

Guohong Du