Shengyi Technology Co., Ltd.

Guangdong Shengyi Sci. Tech Co., Ltd.

Guofang Tang

Suwen Ye

Yong Chen

Peng Sun

Yongjing Xu

Zhongqiang Yang

Minshe Su

Xiaosheng Su

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition

Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si&#x2014;H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).

Halogen-free and phosphorus-free silicone resin composition, prepreg, laminate board, copper-clad plate using the same, and printed circuit board

Provided are an organic silicon resin composition, prepreg and laminate using the same. The organic silicon resin composition glue solution contains a condensation silicon resin, a catalyst, an auxiliary agent, a white filler and a solvent as necessary components, and is impregnated in a reinforced material such as a sheet-like fiberglass fiber base material and then dried to prepare the prepreg. The prepreg has a net structure via crosslinking of the silicon resin using a condensation reaction. Since the organic silicon resin has ultrahigh heat resistance and yellowing resistance, the present invention applies the silicon resin to a white LED copper-clad laminate instead of a traditional organic resin, satisfying the demand for high heat resistance, and replacing the ceramic substrate to be a new heat-dissipating substrate base material.

Organic silicon resin composition, white prepreg and white laminate using same

The present invention relates to an organic silicone resin composition and a prepreg, a laminate, and an aluminum substrate that use the composition. The organic silicone resin composition comprises in terms of parts by weight: 100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, and 0.001-10 parts of an additive. The organic silicone resin composition has the advantages of high heat resistance, halogen-free and phosphorus-free flame retardancy, improved peel strength with copper foil, and low coefficient of expansion, and is applicable in manufacturing the pre-preg, the laminate, and the aluminum substrate for used in a high-performance printed circuit.

Organic silicone resin composition and pre-preg, laminate, copper-clad laminate, and aluminum substrate that use the composition

The present invention relates to a ceramized silicone resin composition and a pre-preg and a laminate that use the composition. The ceramized silicone resin composition comprises: 50-100 parts of a condensation-type silicone resin, 0.0001-2 parts of a catalyst, 5-80 parts of a ceramic-forming filler, and 0.01-50 parts of a flux. The pre-preg and the laminate manufactured using the ceramized silicone resin composition, when used in a sustained high temperature, can transform into complex ceramized structure thereby providing ceramic properties, thus providing great fireproof and flame retardant effects; also, manufacturing of the laminate is similar to that of a regular FR-4 laminate, where the process is easy to operate. The ceramized silicone resin composition, the pre-preg, and the laminate have the advantages of being halogen-free, low smoke, low toxicity, flame retardant, and fireproof, provide a novel concept and a novel method in terms of flame retardancy and fire resistance, accelerate the research progress in laminate passive fire protection technology, and have broad prospects in the field of fire protection and fire resistance.

Ceramized silicone resin composition and pre-preg and laminate that use the composition

The present invention discloses a thermoset resin composition including epoxy resin other than brominated epoxy resin, styrene maleic anhydride copolymer and additive-type flame retardant. The thermoset resin composition also includes an active ester. The thermoset resin composition is used to prepare resin sheet, resin coated copper, prepreg, laminate, copper clad laminate and printed wiring board, and so on. Said thermoset resin composition remarkably reduces the probability of delamination for the PCB laminate, and overcomes drawback of the tetrabromobisphenol A to introduce dielectric properties which will deteriorate the system. The obtained resin composition has good thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and good flame resistance.

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Guangdong, China

Guofang Tang