Han's Laser Technology Industry Group Co., Ltd.

Guodong Ma

Yunfeng Gao

Jiangang Yin

Wei Zhu

Xiaojun Zhang

Xiao Liu

Jiangang Tang

Yanhua Wang

Changhui Zhuang

Jiangang Lu

Fuhai Li

Xuerui Yuan

Lingtian Diao

Yuguo Peng

Zhixian Chen

A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first COlaser beam the coating via a COfocusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and debris generated during removal of the coating are removed while the coating is removed; focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire; wherein the second path coincides with the first path; scanning, by the second COlaser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second COlaser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels.

Method and device for cutting sapphire

A laser processing method for a sapphire includes: acquiring an image of the sapphire during processing; performing an edge detection to the image to acquire a coordinate of a crack; determining an offset parameter according to the coordinate of the crack; adjusting a laser processing position according to the offset parameter; and further processing the sapphire in accordance with the adjusted laser processing position.

Laser processing method, apparatus for sapphire and storage medium

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Shenzhen, China

Guodong Ma