Guangdong University of Technology

Byd Company Limited

Guocong Chen

Jian Gao

Lanyu Zhang

Qing Gong

Xinping Lin

Haixiang Deng

Yuheng Luo

Shumin Wang

Shuming Zhao

Maolin Ren

Xiaofang Li

Zhihai Li

Liuping Tang

Huawen Lin

Yongbin Zhong

Wenxiu Lai

Changcai Zhang

Yachao Liu

A cooperative bonding method for a bonding head of a wire bonding machine, including setting an initial height value of the vertical lifting mechanism to be a difference value; upon receiving a bonding instruction, controlling the bonding head to perform an positioning operation on the target processing chip, controlling the vertical lifting mechanism to descend a preset distance; during the positioning operation of the bonding head on the target processing chip, when the acceleration motion and the overshoot is completed, controlling the vertical lifting mechanism to rise back; and during the rise back process, the pad of the chip does not exceed a residual vibration curve of the bonding head. This achieves the technical effect of improving the bonding efficiency of the bonding head within a small searching area while avoiding impacts on the chip caused by the overshoot during high acceleration positioning of the bonding head.

Cooperative bonding method for a bonding head of a wire bonding machine and a wire bonding machine

A decoupled XY parallel micro-positioning stage, including a central moving platform, fixed mechanisms, bridge-type micro-displacement amplification mechanisms, a four-bar symmetrical flexible guide mechanism and a piezoelectric ceramic. Each fixed mechanism is arranged between adjacent amplification mechanisms and is symmetrical about X and Y axes centered on the moving platform. The amplification mechanism is symmetrically arranged with respect to the X and Y axes, and includes two first and second longitudinal beams and multiple crossbeams. The two first longitudinal beams are provided in parallel and spaced apart. The two second longitudinal beams are arranged spaced apart between the two first longitudinal beams, and are connected to the two first longitudinal beams via the crossbeams. The crossbeams are connected to the longitudinal beams via a flexible hinge. The piezoelectric ceramic is arranged between the two first longitudinal beams.

Decoupled XY parallel micro-positioning stage

A defroster and a vehicle are provided. The defroster includes: a housing defining an air outlet; a heating device disposed in the housing; an air blower defining a blowing outlet and disposed in the housing; and an air duct defining a duct inlet and a duct outlet, the air duct being disposed between the blowing outlet and the heating device so that air blown out from the blower outlet enters the air duct via the duct inlet and goes out of the air duct via the duct outlet, then passes through the heating device to exchange heat with the heating device, and is discharged out of the housing via the air outlet, wherein an area of the duct inlet is different from that of the duct outlet.

Defroster and a vehicle having the same

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Guangdong, China

Guocong Chen