Boe Technology Group Co., Ltd.

Guocai Zhang

Junwei Yan

Guangcai Yuan

Zhanfeng Cao

Shaodong Sun

Shihao Dong

Chengfei Wang

Jianguo Wang

Yingwei Liu

Ke Fei Wang

Zhiwei Liang

Ke Wang

Pengcheng Dong

Xue Dong

Qi Qi

Haixu Li

Xinhong Lu

Muxin Di

Haoran Gao

Lilei Zhang

Wenyue Fu

Xiaojie Pan

A substrate includes: a base substrate; an organic layer on the base substrate with openings defined through the organic layer; a first metal layer including first metal patterns, where the first metal pattern is in the opening, and includes a first portion parallel to a bottom of the opening and a second portion parallel to a lateral wall of the opening; a second metal layer having a thickness greater than a thickness of the first metal layer; where the second metal layer includes second metal patterns, the second metal pattern is located in the opening and is in contact with the first metal layer; and, a distance from a surface of the first metal layer away from the base substrate to a plane where the base substrate is located is smaller than a distance from a surface of the organic layer away from the base substrate to the plane.

Substrate and method for manufacturing the same, and display panel

The present disclosure provides a driving substrate, a method for preparing the same, and a display device. The driving substrate includes: a base substrate; a stress buffer layer located on the base substrate; a plurality of first wirings located on a surface of the stress buffer layer away from the base substrate; a first insulating layer located on a surface of the first wiring away from the base substrate; a plurality of second wiring structures located on a surface of the first insulating layer away from the base substrate; a second insulating layer located on a surface of the second wiring structure away from the base substrate; an electronic element located on a surface of the second insulating layer away from the base substrate.

Driving substrate, method for preparing the same, and display device

The present disclosure provides a gas-solid separation structure including: a feeding pipeline including a first feeding part, a second feeding part and a first valve disposed between the first and second feeding parts; a discharge pipeline having a first opening and a second opening opposite to each other, the second feeding part extending into the discharge pipeline via the first opening; wherein an exhaust channel is formed between the second feeding part and the discharge pipeline, exhaust holes are formed in a portion of the discharge pipeline opposite to the second feeding part, and the exhaust channel is in communication with the exhaust holes. The present disclosure further provides a feeding device and an electrochemical deposition apparatus. The present disclosure can improve the problem of interference with medicine powder release caused by gases entering the discharge pipeline.

Gas-solid separation structure, feeding device and electrochemical deposition apparatus

The present disclosure provides an air drying device including: a base including opposing top and bottom portions, the top portion including at least one first bearing surface; and at least one bearing plate disposed at the top portion of the base. The bearing plate includes a second bearing surface, and the first bearing surface is inclined relative to the second bearing surface.

Air drying device

The present disclosure relates to a filling device and apparatus, an electrochemical deposition system, and a filling method. The filling device includes: a feeding structure including a first feed port and a first discharge port; a container including a second feed port and a second discharge port; a weighing means disposed on the container; a conveying structure disposed between the first discharge port and the second feed port, the second feed port being in communication with the first discharge port via the conveying structure, and the conveying structure being configured to convey a material output from the first discharge port to the second feed port; and a control structure connected to the weighing means and the conveying structure, respectively, and configured to control a conveying speed of the conveying structure according to the weight detected by the weighing means.

Filling device and apparatus, electrochemical deposition system and filling method

The present disclosure provides an array substrate and a manufacturing method thereof, a display panel and a backlight module. The manufacturing method of the array substrate includes: providing a base substrate; forming a metal wiring layer on a side of the base substrate, the metal wiring layer including a first copper metal layer; forming a planarization layer on a side of the metal wiring layer away from the base substrate; forming a drive lead layer on a side of the planarization layer away from the base substrate, the drive lead layer being electrically connected to the metal wiring layer, the drive lead layer including a second copper metal layer with a thickness larger than that of the first copper metal layer; forming a functional device layer on a side of the drive lead layer away from the base substrate.

Array substrate and manufacturing method thereof, display panel and backlight module

An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.

Array substrate, method for preparing array substrate, and backlight module

The present application relates to a substrate transfer device, comprising a horizontally arranged cross beam, and support beams longitudinally arranged at two ends of the cross beam, wherein a substrate carrier is suspended on the cross beam, the substrate carrier is located between the two support beams, and the substrate carrier is parallel to a plane where the two support beams are located, the substrate carrier comprises two side walls oppositely arranged in a horizontal direction, and each of the support beams is provided with an auxiliary clamping structure for clamping the substrate carrier during transferring of the substrate carrier.

Substrate transfer device

The present disclosure provides a carrier liquid leakage preventing device and an electrochemical deposition apparatus. The carrier liquid leakage preventing device is used for containing liquid medicine dripping from a carrier; the carrier liquid leakage preventing device comprises: a guide rail disposed along a first direction, the first direction is a vertical direction perpendicular to the horizontal plane or a direction at an angle to the horizontal plane; a leakage preventing groove provided on the guide rail and capable of performing a lifting movement along the guide rail so as to move above or below the carrier; and a driver for driving the lifting movement of the leakage preventing groove.

Growing community of inventors

Beijing, China

Guocai Zhang