Huawei Technologies Co., Limited

Zte Corporation

Guo Yang

Quanming Li

Shuainan Lin

Linfang Jin

Wei Li

Zhiguo Zhang

Yongfu Sun

Yiling Liu

Zihua Xu

Zongzheng Li

Jiajia Sui

Tao Huang

Jianliang Wang

Jian Shi

Zhi Yuan

Zhen Xu

Teng Long

Wenming Shi

Zhongshi Xie

Wanshuai Zhang

Huipeng Wu

Yingnan Liu

Xiaohu Liu

A folding device and a heat dissipation apparatus, where the folding device includes a heat collection element, including a heat collection plate and a first shaft sleeve, where a first end of the heat collection plate is in contact with a heat source in a first folding part, and a second end of the heat collection plate is coupled to an outer wall of the first shaft sleeve, the first shaft sleeve is sleeved on a rotating shaft, and a third end of the cooling element is in contact with the rotating shaft, and a fourth end of the cooling element is in contact with a heat dissipation device in a second folding part.

Folding device and heat dissipation apparatus

A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.

Heat-conducting assembly and terminal

Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.

Wireless charging device

In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.

Circuit board, method for manufacturing circuit board, and electronic device

This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a tangent-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.

Film-like heat dissipation member, bendable display apparatus, and terminal device

A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region.

Heat dissipation panel, heat dissipation apparatus, and electronic device

An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.

Heat dissipation structure for electronic device and electronic device

The present disclosure provides an injection molding apparatus, including a fixed mold component, a movable mold component, a first positive electrode module, and a first negative electrode module. The fixed mold component has an injection port and a transmission runner, to receive injection-molding melt. The movable mold component has a molding groove communicated with the transmission runner. The first positive electrode module and the first negative electrode module are disposed on a first side and a second side of the molding groove respectively, where the first side and the second side are opposite to each other. The first positive electrode module cooperates with the first negative electrode module to form an electric field between the first side and the second side of the molding groove, to perform electric field excitation on the injection-molding melt flowing into the molding groove.

Injection molding apparatus

A method for sharing reverse channel in trunk communication system includes: step A, establishing a forward channel and one or more in a group: step B, mobile stations in idle state determine a sharing reverse channel that can be used based on information of the sharing reverse channel; step C, the mobile station transmits information through the sharing reverse channel. Furthermore a system for sharing reverse channel in trunk communication system includes: channel establishing means, for establishing a forward channel and one or more in a group; reverse channel determining means, for determining a sharing reverse channel that can be used by a mobile station based on the information of the sharing reverse channel; reverse channel information transmitting means, for transmitting information through the sharing reverse channel. This invention saves the air and physics sources of the system, and reduces the collision probability of the signaling of each mobile station in idle state.

Method and system for sharing reverse channel in trunk communication system

A method for realizing forward channel sharing in time division communication system, which completes group configuration at the cluster control service center server and modifies the attributes of all the users to enable the users to support multi-user packet MUP service, including: (a) the cluster user initiates a group call; the access network allocates a unique group identifier MACIndex for the group call after receiving the call request from the calling cluster user and informs all of the users within the group about this MACIndex (); (b) after the communication starts (), the access network packets the user data of one or more groups with multi-user packet MUP, packets the user data of each group into one sub-packet and does scheduling, then transmits the packets through forward channel (); (c) after receiving the MUP packets from the forward channel, the cluster user looks into the MUP packets for the sub-packet that matches the MACIndex of its group, thereby realizing group communication (). The present method solves the problem of system delay and supports even more groups.

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Minsk, Belarus

Guo Yang