Samsung Electronics Co., Ltd.

Gunwoo Ryu

Euncheol Lee

Seunghak Lee

Hyunsu Jun

Kihyun Kwon

Provided are a camera module and an imaging apparatus including the same. The camera module includes a printed circuit board (PCB); a first imaging device on the PCB, the first imaging device configured to generate first image data based on a received optical signal; a second imaging device on the PCB, the second imaging device configured to generate second image data based on the received optical signal; a power management integrated circuit (PMIC) on the PCB, the PMIC configured to generate a plurality of power voltages based on an external power voltage received from an external power supply and provide the plurality of power voltages to the first imaging device and the second imaging device; and a connector configured to receive the external power voltage from the external power supply and provide the external power voltage to the PMIC.

Camera module and imaging apparatus including the same

A semiconductor memory device includes a pixel array having pixels, a logic circuit configured to process a signal output by the pixels to generate image data, and sensor pads connected to the logic circuit, where the sensor pads include a first ground sensor pad, a second ground sensor pad, signal sensor pads disposed between the first ground sensor pad and the second ground sensor pad and configured to output the image data, and dummy sensor pads disposed between the first ground sensor pad and the second ground sensor pad and configured not to output the image data, and at least one of the dummy sensor pads is disposed between the signal sensor pads.

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Hwaseong-si, South Korea

Gunwoo Ryu