Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Gunther Zimmer

Wilfried Mokwa

Michael Kandler

Yiannakis Manoli

Jorg Eichholz

Jordan Maclay

Uwe Schoneberg

Hosticka Bedrich

A micromechanical component having a carrier and a deformable element of a flat design disposed parallel to a surface of the carrier, with the deformable element being provided with a mechano-electric signal converter. The carrier and the deformable element are fabricated in one piece out of a semiconductor substrate and are electrically insulated from one another, with the insulation being obtained by a buried layer produced by ion implantation thereby providing a micromechanical component which is suitable for joint integration with electric circuits in CMOS technology.

Micromechanical component and process for the fabrication thereof

A process for manufacturing an integratable capacitative pressure sensor includes the following steps, starting from a semiconductor substrate (1): application of a guard film (2), precipitation of a polycrystalline semiconductor film (4), doping the polycrystalline semiconductor film (4) and removal of the guard film (2) by etching; then insulating the semiconductor zone (7) from the semiconductor substrate (1), and applying an insulator film (8) on the insulated semiconductor zone (7). The pressure sensor product, which is compatible with CMOS circuits and has increased sensor accuracy, includes a semiconductor zone (7) insulated from the semiconductor substrate (1) and an insulator film (8) applied on the insulated semiconductor zone (7), the polycrystalline semiconductor film (4) being located on the insulator film (8) above the insulated semiconductor zone (7).

Integratable capacitative pressure sensor

Integratable capacitative pressure sensor and process for its manufacture

Circuit and a method for measuring a quantity influencing the

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Duisburg, Germany

Gunther Zimmer