Leybold-heraeus Gmbh

W.c. Heraeus Gmbh

W.c. Heraeus Gmbh & Co Kg

Gunther Herklotz

Christoph Simons

Walter G Reichelt

Jurgen Reuel

Hans Eligehausen

Lutz Schrapler

Fine wires of a gold alloy of 0.05 to 0.95 wt % platinum, palladium or a mixture thereof; 0.001 to 0.1 wt % mischmetal containing at least 50 wt. % of cerium; and 0 to 0.1 wt % of alkaline earth metal. The wire has a favorable strength-to-elongation ratio and is suitable both for wire bonding and for making the ball bumps of flip chips.

Fine wire of gold alloy, method for manufacture thereof and use thereof

Sputtering installation for the reactive coating of a substrate with

The present invention provides low-current carrying rem-reed switch contacts, preferably for operation under vacuum or under a protective gas. The contacts comprise a medium-hard magnetic material substrate which may contain anomalies on the surface. These are covered by an intermediate layer from 1 to 20 .mu.m of at least one metal selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium and tantalum. This intermediate layer is then covered with a noble metal layer, for example alloys of gold or silver, and preferably by ruthenium.

Electrical switching contact

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Bruchkobel, Germany

Gunther Herklotz