Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Other

Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno

E2ip Technologies Inc.

Gunther Dreezen

Anja Henckens

Liesbeth Theunissen

Stijn Gillissen

Rudolf Oldenzijl

Qili Wu

Inge Van Der Meulen

Jianping Chen

Jing Yang

Chao B Zhang

Jeroen Van Den Brand

Allison Yue Xiao

Ard De Zeeuw

Jie Cao

Nicole Auweiler

Bo Xia

Rudie Oldenzijl

Ashok Sridhar

Jose Garcia-Miralles

Cindy Van Der Borght

Bart Van Remoortere

Inge Vander Meulen

The present invention relates to a positive temperature coefficient composition comprising a semi-crystalline material, at least one binder, from 0.5 to 9.5% by weight of an electronically conductive material and a solvent. Furthermore, the present invention relates to use of a positive temperature coefficient composition according to the present invention in heating elements and sensors. A positive temperature coefficient composition according to the present invention provides low and stable resistance till self-regulating temperature, which allows fast heating of the heating element. Furthermore, the positive temperature coefficient composition according to the present invention has high PTC ration and therefore, has higher safety and more power can be applied to the heating element.

Positive temperature coefficient composition

The present invention relates to a heating element, which is integrated into the construction material. Integration of the heating element according to the present invention into the construction material limits space needed for the heating system. In addition, the used heating element provides reduced power consumption compared to conventional technologies. A construction element according to the present invention comprises a construction material, a heating element comprising a foil comprising a PTC composition layer or a PTC composition layer, at least one adhesive layer, a substrate and a connector, wherein said heating element is embedded between said construction material and said substrate, and wherein said PTC layer comprises a semi-crystalline material, at least one binder and an electronically conductive material.

Printed heater elements integrated in construction materials

The present invention relates to a conductive paste composition for solar photovoltaic cells comprising metal particles dispersed in a suitable carrier therefor, wherein said carrier comprises a solvent and a resin, and wherein at least a portion of said metal particles are characterized by having a &#x3c8; value, as defined by X-ray diffraction&#x3c;0.0020, having at least 50% degree of crystallinity, and being anisotropic with respect to crystallographic direction.

Sinterable composition for use in solar photovoltaic cells

This invention is a flexible conductive ink composition comprising (A) a resin binder, (B) silver-plated core conductive particles, and (C) conductive particles having a surface area at least 1.0 m/g.

Flexible conductive ink

The present invention relates to a process of forming electrical conductor on a substrate comprising the steps of a) providing a substrate; b) providing an electrically conductive composition; c) applying said electrically conductive composition to at least one part of said substrate; and d) exposing said electrically conductive composition on the substrate to a near infrared light to form an electrical conductor. NIR light cure provides improved electrical properties of the cured composition without damaging heat sensitive substrates.

Processing of polymer based inks and pastes

The present disclosure relates to a method for curing a heat-curable material () in an embedded curing zone () and an assembly resulting from such method. The method comprises providing a heat-conducting strip () partially arranged between a component () and a substrate () that form the embedded curing zone () therein between. The heat-conducting strip () extends from the embedded curing zone () to a radiation-accessible zone () that is distanced from the embedded curing zone () and at least partially free of the component () and the substrate (). The method further comprises irradiating the heat-conducting strip () in the radiation-accessible zone () by means of electromagnetic radiation (). Heat () generated by absorption of the electromagnetic radiation () in the heat-conducting strip () is conducted from the radiation-accessible zone () along a length of the heat-conducting strip () to the embedded curing zone () to cure the heat-curable material () by conducted heat () emanating from the heat-conducting strip () into the embedded curing zone ().

Curing a heat-curable material in an embedded curing zone

The present invention relates to a conductive coating composition comprising a polyolefin copolymer resin comprising an olefin monomer and acrylic acid comonomer or (meth)acrylic acid comonomer, a plurality of anisotropic nanoparticles and a solvent.

Conductive transparent coating for rigid and flexible substrates

Provided herein are conductive ink compositions having a good balance between adhesion to substrate, stability of submicron-sized particles, the ability to be sintered at relatively low temperatures, and good electrical conductivity. In one aspect, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the invention relates to methods for adhering submicron silver particles to a non-metallic substrate. In certain aspects, the invention relates to methods for improving the adhesion of a submicron silver-filled composition to a non-metallic substrate.

Submicron silver particle ink compositions, process and applications

The present invention relates to thermally curable adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The thermally curable adhesives comprise at least one thermosetting resin, electrically conductive particles having an average particle size of 1 &#x3bc;m to 50 &#x3bc;m, and at least one metal precursor, wherein the metal precursor decomposes substantially to the corresponding metal during the thermal curing of the thermally curable adhesive.

Electrically conductive adhesives comprising at least one metal precursor

The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesive of the present invention comprises one or more epoxy resins, silver-coated particles having a silver content of 2 to 30 wt.- %, based on the total amount of the silver-coated particles, and one or more amine-epoxy adducts, comprising one or more functional groups, each derived from an alkyl-substituted nitrogen-containing heterocycle.

Electrically conductive adhesives comprising silver-coated particles

The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesives comprise at least one resin component, micron-sized electrically conductive particles having an average particle size of 2 &#x3bc;m to 50 &#x3bc;m, and from 0.01 to 15 wt. % of sub-micron-sized electrically conductive particles having a average particle size of 300 nm to 900 nm.

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Balen-Olmen, Belgium

Gunther Dreezen