Osram Gmbh

Osram Opto Semiconductors Gmbh

Osram Opto Semiconductor Gmbh

Osram Ag

Siemens Aktiengesellschaft

Osram Opto Semi-conductors Gmbh Co. Ohg

Oram Gmbh

Patent Treuhand Gesellschaft Fur Elektrische Gluhlampen Mbh

Osram Opto Semiconductors Gesellschaft MIT Beschraenkter Haftung

Günter Waitl

Berthold Hahn

Herbert Brunner

Volker Härle

Georg Bogner

Karlheinz Arndt

Klaus Höhn

Franz Schellhorn

Norbert Stath

Peter Schlotter

Ralf Schmidt

Jürgen Schneider

Ulrike Reeh

Mario Wanninger

Werner Marchl

Alexandra Debray

Michael Hiegler

Andries Ellens

Franz Zwaschka

Franz Kummer

Werner Späth

Jörg Erich Sorg

Markus Hofmann

Ewald Karl Michael Guenther

Alexander Wilm

Simon Blümel

Patrick Kromotis

Bernhard Bachl

Werner Spath

Markus Zeiler

Frank Möllmer

Matthias Winter

Günter Kirchberger

Thomas Höfer

Jörg Strauss

Rainer Sewald

Stefan Grötsch

Bert Braune

Gertrud Kräuter

Wolfgang Gramann

Harald Jäger

Heinz Haas

Dieter Eissler

Alfred Langer

Robert Lutz

Monika Rose

Wolfgang Lex

Manfred Wolf

Stefan GRÖTSCH

Reinhard Weitzel

Klaus HÖHN

Rolf HÄNGGI

The light-radiating semiconductor component has a radiation-emitting semiconductor body and a luminescence conversion element. The semiconductor body emits radiation in the ultraviolet, blue and/or green spectral region and the luminescence conversion element converts a portion of the radiation into radiation of a longer wavelength. This makes it possible to produce light-emitting diodes which radiate polychromatic light, in particular white light, with only a single light-emitting semiconductor body. A particularly preferred luminescence conversion dye is YAG:Ce.

Light-radiating semiconductor component with a luminescence conversion element

An illumination device is specified which comprises an optoelectronic component having a housing body and at least one semiconductor chip provided for generating radiation, and a separate optical element, which is provided for fixing at the optoelectronic component and has an optical axis, the optical element having a radiation exit area and the radiation exit area having a concavely curved partial region and a convexly curved partial region, which at least partly surrounds the concavely curved partial region at a distance from the optical axis, the optical axis running through the concavely curved partial region.

Illumination device

A configuration of multiple LED modules having a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer. The first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.

Configuration of multiple LED module

A housing for an optoelectronic component which includes a carrier with a chip mounting surface is disclosed. An optical element which is produced separately from the carrier is applied to the carrier. The chip mounting surface and the optical element define a parting plane, the parting plane between carrier and optical element being arranged in the plane of the chip mounting surface. Also disclosed is an optoelectronic component having a housing of this type and a method for producing an optoelectronic component of this type.

Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component

A radiation-emitting or -receiving semiconductor chipis soft-soldered for mounting on a leadframeover which a prefabricated plastic encapsulant, a so-called premolded package, is injection-molded. Through the use of a low-melting solderapplied in a layer thickness of less than 10 &#x3bc;m, the soldering process can be carried out largely without thermal damage to the plastic encapsulant

Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof

A leadframe, a housing, a radiation-emitting component formed therefrom, and a method for producing the component includes the leadframe having a mount part with at least one bonding wire connecting area and at least one electrical solder connecting strip into which a separately manufactured thermal connecting part, which has a chip mounting area, is linked. To form a housing, the leadframe is sheathed, preferably, with a molding compound, with the thermal connecting part being embedded such that it can be thermally connected from the outside.

Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component

A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding the LED chip; and a reflective optic disposed after the radiation decoupling surface in the main direction of emission. The LED arrangement is particularly well suited for use in devices such as camera-equipped cell phones, digital cameras or video cameras.

Light-emitting diode arrangement

A lighting device is disclosed comprising a plurality of semiconductor light sources disposed on a carrier, wherein the light from the light sources is coupled into assigned lightguides at a set angle to the surface normals of the carrier and the lightguides are provided with reflecting and light exit faces such that the envelope of the light outcoupling faces forms a curved surface segment.

Lighting device comprising a plurality of semiconductor light sources

An apparatus having a least one fixing element is specified, the fixing element being provided for fixing the apparatus to a housing body of an optoelectronic device and the apparatus being designed as a mount for a separate optical element.

Apparatus for an optoelectronic device and componnent having an optoelectronic device and an apparatus

An illumination device is specified which comprises an optoelectronic component having a housing body and at least one semiconductor chip provided for generating radiation, and a separate optical element, which is provided for fixing at the optoelectronic component and has an optical axis, the optical element having a radiation exit area and the radiation exit area having a concavely curved partial region and a convexly curved partial region, which at least partly surrounds the concavely curved partial region at a distance from the optical axis, the optical axis running through the concavely carved partial region

A configuration of multiple LED modules comprising a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer, wherein the first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.

Configuration of multiple LED modules

Optoelectronic component, having a housing body (), an optoelectronic semiconductor chip () arranged in a recess () of the housing body, and having electrical terminals (A,B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body () is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.

Optoelectronic component

A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.

Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body

A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two electrically isolated portions. The housing further includes a cavity extending inwards from the top of the housing. The conductor portions include respective areas that are exposed at the bottom of the cavity. The semiconductor chip is bonded to one of the exposed areas and a wire bonds the chip to the second exposed area. The conductor portions also terminate in exposed electrodes, which allow for electrical connection of the chip with external devices. A window is formed in the cavity and the walls of the housing that form the cavity may be made of a reflective material. The electrodes remain unexposed to the window but for any residual areas about the chip and bonding wire within the first and second exposed areas. By minimizing the area of the conductor exposed to the window, delamination brought about by the different thermal expansions of the window and conductor are minimized and/or eliminated. Likewise, with a reflective housing covering the base of the cavity that accommodates the window, internal radiation reflection is increased over that which was achieved with an exposed conductor.

Diode housing

Growing community of inventors

Wuppertal, Germany

Günter Waitl