Robert Boschgmbh

Gunter Schmidt

Klaus Heyke

Istvan Ragaly

Gerd Bassler

Franz Armbruster

Albano Paoli

Hans-Peter Sitka

Istvar Ragaly

To improve the stability and robustness of a rectifier and to protect it against atmospheric influences, two plate-like, series-connected semiconductor diodes are soldered to a common tap electrode between them. An external lead wire is soldered to each of the remaining sides of the diodes. The entire soldered structure is embedded in a single mass of resin or plastic, the ends of the electrodes being configured to serve as anchoring elements in the plastic mass.

Two-element semiconductor diode rectifier assembly structure

To improve the stability and robustness of a rectifier and to protect it against atmospheric influences, two semiconductor diodes in the shape of small plates or discs are disposed to hold between them a center electrode. A wire-like lead electrode is held in contact with the remaining side of one diode and the second lead electrode is cup-shaped and its walls surround the diode stack. An inwardly extending lip of the cup-shaped electrode supports a spring which exerts pressure on the enlarged tip of the first lead electrode, thus clamping the entire stack in contact. A cover plate seals the opening of the cup and a resinous mass may be applied over the cover plate to provide a hermetic seal.

Two semiconductor diode rectifier structure

A method for producing strong resistance-welded joints between wires and massive workpieces, especially welded joints between nickel-plated copper wires and steel workpieces. The melting of the nickel coating is insured by producing locally high temperatures and pressures, due to the special configuration of the surface of the workpiece. The work surface is provided with bulges or protrusions which cause a concentration of electrical current and electrode pressure.

Method of resistance welding wires to a massive workpiece

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Reutlingen, Germany

Gunter Schmidt