Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh

Gunter Lossl

Helmut Zauhar

Horst Stock

Crystalline rods or blocks can be sawed into thin wafers by sawing the rod or block into a plurality of wafers that are connected to each other. The wafers can be connected by introducing a connecting agent after each sawing step, into the resulting cutting gaps. The wafers are separated only after the whole rod has been sawed with a two-blade internal-hole saw.

Multiple-blade internal-hole saw for sawing crystalline rods

Crystalline rods or blocks can be sawed into thin wafers by sawing the rod r block into a plurality of wafers that are connected to each other. The wafers can be connected by introducing a connecting agent after each sawing step, into the resulting cutting gaps. The wafers are separated only after the whole rod has been sawed. The method makes possible the use of multiple-blade internal-hole saws, and preferably two-blade internal-hole saws.

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Kirchweidach, Germany

Gunter Lossl