W.c. Heraeus Gmbh

Gunter Herklotz

Thomas Frey

Alfred Bauer

Friedrich Lach

Horst Hartmann

Karl-Heinz Ullrich

Thomas Loose

Bernd Gehlert

Gerhard Arnold

Wolfgang Hempel

Heinz Forderer

A process and apparatus for producing a laminate containing a metal foil strip and a plastic film strip, in which the two strips have stamped structures repeated at regular intervals in the longitudinal direction of the strips and are disposed at contiguous points in the laminate, a pre-stamped strip and the second strip being continuously joined together from one end. To laminate stamped plastic film tape together with a pre-stamped metal foil tape, with the least possible complexity, so that any mismatch between the stamped structures of the two tapes is as small as possible, after the strips have been merged, the position of position markings for the stamped structures in the second strip and on the pre-stamped strip are successively scanned and, once a predetermined position of the position markings has been reached, a stamped structure is introduced into that region of the second strip situated in front of the site of the joining together, at a distance from the predetermined position corresponding to an integral multiple of the interval at which the stamped structures of the pre-stamped metal strip are repeated.

Apparatus for producing a laminated strip of a metal foil and a plastic

Process and apparatus for producing a laminated strip of a metal foil

Silver-tin alloys can be deposited by the galvanic method from a cyanide-free bath which is prepared using silver as the nitrate or diammine complex, tin as the soluble tin(II) or tin(IV) compound and mercaptoalkane-carboxylic acids and -sulfonic acids, Uniform and adhering coatings of silver-tin alloys with a silver content of approximately 20 to 99 weight % can be deposited from said bath. Silver-tin alloys are electrodeposited from said bath at a pH of 0 to 14 and a current density of 0.1 to 10 A/dm.sup.2.

Electroplating bath for the electrodeposition of silver-tin alloys

Lead frames completely surface-plated with palladium have a nickel-phosphorus or copper-tin layer between the base element, made for example of copper, and the palladium layer. Such lead frames exhibit good bondability and good solderability without tinning.

Lead frame for integrated circuits

A thin galvanically deposited gold-containing surface layer is backed by a support layer containing a palladium alloy and having a thickness between 0.05 .mu.m and 0.5 .mu.m. In a preferred embodiment the surface layer and the support layer have a combined thickness of less than 0.5 .mu.m.

Electric outlet element having double flash

An electrical contact element having a core part made of an iron/nickel alloy and a gold/tin alloy applied to a portion of the core part which serves as a solderable connection part. The gold/tin alloy has a tin content of from about 10 to about 40% by weight and an adhesive layer, formed of a silver/tin alloy and containing about 10 to 50% by weight tin, is located between the core part and the gold/tin alloy.

Electrical contact element

Bright palladium coatings which are pore-free and free of fissures and have a low internal stress are produced by galvanic depositing from a bath which contains tetrammine palladium dibromide, ammonium bromide, sulfamic acid and/or ammonium sulfamate and nicotinic acid and/or nicotinamide.

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Bruchkobel, Germany

Gunter Herklotz