Siemens Aktiengesellschaft

Gunter Didschies

Josef Kirschbauer

Michael Rogalli

Josef Mundigl

Jurgen Fischer

Dieter Dlugosch

Roland Prass

Erich Hopf

Karl Brunner

Hans Barking

The smart card has a semiconductor chip combined with a leadframe. The smart card is rendered operationally and functionally reliable with regard to bending and tensile stresses, in that the connecting tabs which form the electrical contacts of the leadframe are extended to the outside and embedded in the plastic card body. Beads are incorporated for the additional relief of mechanical stresses.

Smart card with card body and semiconductor chip on a leadframe

A chip card includes a plastic card. A plastic body is disposed in the plastic card and a semiconductor chip is surrounded by the plastic body. Contact strips are electrically connected with the semiconductor chip and are connected to the plastic card. The contact strips have a flexible region near and outside of the plastic body and are advantageously parts of a lead frame. An adhesive which joins the contact strips to the plastic card has at least three layers including a middle layer of flexible material.

Chip card

A system for applying insulating tape to a three-dimensionally curved conductor, particularly of the type used in high voltage applications. A wrapping ring having an axis of rotation is oriented with respect to the conductor such that the axis of rotation is always placed on the spinning point of the insulating tape, the spinning point being at the location where the tape tangentially contacts the conductor during wrapping. Such an orientation of the wrapping ring avoids the formation of pockets at the curved places of the conductor.

Method for wrapping three-dimensionally curved conductors

Growing community of inventors

Nurnberg, Germany

Gunter Didschies