Melexis Technologies Nv

Gunnar Munder

Thomas Freitag

Heiko Grimm

Peter Teichmann

An edge crack monitoring system for an integrated circuit provided on a die, comprises a conductive trace comprising at least a first conductive path for allowing current in a first direction, and a second adjacent conductive path for allowing current in a second direction opposite to the first direction. Both adjacent conductive paths form at least one loop surrounding a semiconductor device on a die. The arrangement of the trace is adapted to provide compensation of EM interferences. The trace comprises two terminals being connectable to a detection circuit for detecting damages by generating a fault signal upon detection of disruption of the conductive trace due to a damage. The conductive trace comprises high resistance portions with a resistance of at least 1 k&#x3a9;, adapted for reducing self-resonance.

Die edge integrity monitoring system

A device for position sensing comprises sensing means arranged for producing at least two sensor signals, and a signal construction unit. The signal construction unit comprises selection means for selecting in a serial way one of at least two time-synchronous signals, sampling means for sampling a selected time-synchronous signal at given sampling instants, storage means for storing sampled data representing the selected time-synchronous signal and timing information indicating which of the given sampling instants were used to obtain the sampled data, and processing means for determining at one of the given sampling instants a value for at least one of said time-synchronous signals that was not sampled at the one given sampling instant by performing an interpolation using data values of the at least one time synchronous signal stored in the storage means and obtained at another point in time than the one given sampling instant.

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Erfurt, Germany

Gunnar Munder