Siemens Aktiengesellschaft

Gunnar Dietz

Stefan Völkel

Markus Mauersberger

Holger Hoffmann

Michael Leipenat

Harald Hofmann

A method for determining the remaining usability of a semiconductor module in normal use. The semiconductor module is thermally coupled to a cooling device. A predefined electrical load is applied to the semiconductor module while predefined cooling is effected by the cooling device. A temperature of a semiconductor element of the semiconductor module is sensed at least for the predefined electrical load on the semiconductor module. The sensed temperature is compared with a comparison temperature in a first comparison. The comparison temperature is assigned to the predefined electrical load with the predefined cooling, and prediction data for the remaining usability of the semiconductor module in normal use up to a usability end are determined at least in accordance with the first comparison.

Determining the remaining usability of a semiconductor module in normal use

A method for operating power semiconductors arranged in converters, includes measuring with a temperature sensor a temperature of at least one of the power semiconductors, performing a comparison of the temperature of the at least one power semiconductor with a reference temperature and providing a result of the comparison; activating a pre-heating phase for preheating the power semiconductors as a function of the result; during the pre-heating phase, defining a pre-heating current; and impressing the pre-heating current into an electrical load.

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Nürnberg, Germany

Gunnar Dietz