Dow Silicones Corporation

Dow Corning Corporation

Dow Corning Toray Company, Ltd.

Dupont Toray Specialty Materials Kabushiki Kaisha

Ddp Specialty Electronic Materials US 9, LLC

Gunn Jo

Bokyung Kim

Makoto Yoshitake

Akito Hayashi

Maki Itoh

Haruna Yamazaki

Wonbum Jang

Bo Kyung Bona Kim

Ju Young Yook

Jina Chon

Min-Hee Kwon

Kyungdong Han

A UV curable silicone adhesive composition and method for its preparation are provided. The UV curable silicone adhesive composition is useful in electronic device fabrication for adhering components such as fingerprint sensors to substrates, such as OLED display devices.

Silicone adhesive composition and methods for its preparation and use for electronic device fabrication

A silicone pressure-sensitive adhesive composition is curable by an addition reaction, condensation reaction, or a radical reaction with the use of an organic peroxide, and is characterized by comprising an azeotropic solvent such as a mixture of an aromatic solvent, and an aliphatic alcohol or an aliphatic ester. Although the silicone pressure-sensitive adhesive composition can be cured by heating at relatively low temperatures, the residual solvent in a silicone pressure-sensitive adhesive can be reduced.

Silicone pressure-sensitive adhesive composition

A pressure sensitive adhesive film comprises a substrate film and a pressure sensitive adhesive (PSA) layer formed on a surface of the substrate film. The PSA layer is formed from a silicone composition comprising: a diorganopolysiloxane having at least two alkenyl groups in a molecule and having a viscosity at 25&#xb0; C. of from 10,000 to 1,000,000 mPa&#xb7;s; (B) a diorganopolysiloxane having at least one alkenyl group in a molecule, and being raw and rubber-like at 25&#xb0; C. or having a viscosity at 25&#xb0; C. of more than 1,000,000 mPa&#xb7;s; (C) an organopolysiloxane resin represented by the following average unit formula: (RSiO)(SiO), wherein each Rrepresents a halogen-substituted or unsubstituted monovalent hydrocarbon group free from an alkenyl group and x is a number from 0.5 to 1.0; (D) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (E) silica fine powder; and (F) a hydrosilylation catalyst.

Silicone composition and a pressure sensitive adhesive film having a pressure sensitive adhesive layer made from the composition

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (RSiO)(RSiO)(RSiO)(RSiO), wherein, Rare the same or different alkyl groups having from 1 to 12 carbons, alkenyl groups having from 2 to 12 carbons, aryl groups having from 6 to 20 carbons, or aralkyl groups having from 7 to 20 carbons, provided that at least two Rin a molecule are the alkenyl groups; Ris an aryl group having from 6 to 20 carbons or an aralkyl group having from 7 to 20 carbons; Ris an alkyl group having from 1 to 12 carbons; and a, b, c, and d are respectively numbers satisfying: 0.01&#x2266;a&#x2266;0.5, 0&#x2266;b&#x2266;0.7, 0.01&#x2266;c&#x3c;0.7, 0.1&#x2266;d&#x3c;0.9, and a+b+c+d=1; (B) a linear organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group in a molecule; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a hydrosilylation-reaction catalyst. The curable silicone composition has excellent handling/workability and forming a cured product with a high refractive index and low gas permeability when cured.

Curable silicone composition, cured product thereof, and optical semiconductor device

This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.

Reactive silicone composition, hotmelt material made therefrom, and curable hotmelt composition

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Chungchungbuk-do, South Korea

Gunn Jo