Samsung Electronics Co., Ltd.

Gunhee Cho

Wonyoung Choi

Seunghan Kim

A semiconductor memory device includes a receiving circuit, a multiplexing circuit, a decoding circuit and a memory cell array. The receiving circuit receives a plurality of input command/address (CA) signals, and generates a plurality of CA signal groups based on the input CA signals and a clock signal. The multiplexing circuit operates in one of a first operation mode and a second operation mode based on a mode selection signal, outputs the plurality of CA signal groups as a plurality of selected CA signal groups in the first operation mode, and generates the plurality of selected CA signal groups by multiplexing the plurality of sub-CA signals included in the plurality of CA signal groups in the second operation mode. The decoding circuit generates a plurality of output CA signals based on the plurality of selected CA signal groups.

Semiconductor memory device and memory module having various operation modes

A semiconductor memory device includes a data input/output (I/O) buffer, a data first-in/first-out (FIFO) circuit, an address comparing circuit. The data I/O buffer provides a memory cell array with write data. The data FIFO circuit includes plurality of data FIFO buffers which store read data that is read from the memory cell array in each of a plurality of read operations. The data FIFO circuit outputs data stored in one of the plurality of data FIFO buffers based on a plurality of sub matching signals. The address comparing circuit sequentially stores previous addresses accompanied by first commands designating the plurality of read operations and generates the plurality of sub matching signals based on a comparison of the previous addresses and a present address accompanied by a second command designating a present read operation.

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Suwon-si, South Korea

Gunhee Cho