Lg Innotek Co., Ltd.

Lg Innotek

Lg Innotex Co., Ltd.

Gun Kyo Lee

Yun Min Cho

Jong Woo Lee

In Yong Park

Byung Mok Kim

Ju Young Lee

Sun Mi Moon

Yu Dong Kim

Nam Seok Oh

Su Jung Jung

Young Hun Ryu

Nak-Hun Kim

Kwang Hee Lee

Dae Hee Lee

Nak Hun Kim

Byung Soo Ryu

Seong Hoon Jang

Jung Su Jung

Provided is a light emitting device package. The light emitting device package comprises a body, a heat diffusing member, a light emitting diode (LED), and a buffer layer. A cavity with an opened topside is formed in the body. The heat dissipation member is disposed between a bottom surface of the cavity and a lower surface of the body. The LED is disposed on one of an electrode disposed on the bottom surface of the cavity. The buffer layer is disposed between the heat dissipation member and a pad and has a thickness thinner than a thickness of the heat dissipation member.

Light emitting device package and ultraviolet lamp having the same

A light-emitting element package according to an embodiment comprises: a substrate; a conductive layer arranged on the substrate; at least one light-emitting chip arranged on the substrate; a wire for electrically connecting the conductive layer and the at least one light-emitting chip; a wavelength conversion unit arranged on the light-emitting chip; and a molding unit arranged on the substrate so as to enclose the light-emitting chip and the wire and to expose the upper surface of the wavelength conversion unit, wherein the distance from the upper surface of the light-emitting chip to the upper surface of the wavelength conversion unit is larger than a value obtained by adding 37 &#x3bc;m to the distance from the upper surface of the light-emitting chip to the highest point of the wire.

Light-emitting element package

A light-emitting element package, according to one embodiment of the present invention, comprises: a circuit board including first and second regions having different heights; light-emitting elements respectively disposed in the first and second regions; and phosphor layers respectively disposed on the light-emitting elements, wherein the light-emitting elements are disposed within a 100-&#x3bc;m distance in the horizontal direction.

Light emitting element package having three regions

An intelligent type lamp and a vehicle lamp apparatus are disclosed. The lamp includes a first substrate, a second substrate disposed on the first substrate, and a plurality of light sources disposed on the second substrate, wherein the light sources are grouped into at least one light source array, in each of which the light sources are disposed in a line, and the at least one light source array includes neighboring first and second light source arrays electrically isolated and individually driven. The light sources of the first light source array may be electrically isolated and individually driven, and the light sources of the second light source array may be electrically isolated and individually driven. Alternatively, the light sources of the first light source array may be electrically isolated and individually driven, and the light sources of the second light source array may be electrically connected and simultaneously driven.

Lamp and vehicle lamp apparatus using the same

A lamp unit may be provided that includes: a first substrate; a second substrate disposed on the first substrate; and a plurality of light sources disposed on the second substrate, wherein at least two light source arrays are provided, in each of which a plurality of the light sources are disposed in a row, wherein at least a first light source array and a second light source array among the light source arrays are individually driven, wherein the second substrate comprises an upper surface including a first surface on which the first light source array is disposed and a second surface on which the second light source array, and wherein the first surface is higher than the second surface.

Lamp unit producing various beam patterns

Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board having a cavity and including a circuit pattern at a region which does not have the cavity, an insulation substrate disposed in the cavity while being formed, at an upper portion thereof, with at least one pad, and at least one light emitting device disposed on the pad, wherein a joining structure is disposed between a bottom surface of the cavity and a bottom surface of the insulation substrate.

Light emitting module

Disclosed is a light emitting device including a light emitting structure comprising a first semiconductor layer, an active layer and a second semiconductor layer, a phosphor plate disposed on the second semiconductor layer, a first electrode portion disposed on the phosphor plate, and a plurality of bonding portions disposed between the light emitting structure and the phosphor plate, the bonding portions bonding the phosphor plate to the light emitting structure, wherein each bonding portion includes at least one first bonding portion electrically connected to the first electrode portion.

Light emitting device

Embodiments disclose a light emitting device package including an insulating layer, a first lead frame and a second lead frame disposed on the insulating layer electrically separate from each other, a light emitting device disposed on the second lead frame electrically connected to the first lead frame and the second lead frame, the light emitting device includes a light emitting structure having a first conduction type semiconductor layer, an active layer, and a second conduction type semiconductor layer and a lens which encloses the light emitting device, wherein the insulating layer has an end portion projected beyond at least one of an end portion of the first lead frame and an end portion of the second lead frame, to form an opened region which exposes the insulating layer.

Light emitting device package

A lamp unit may be provided that includes: a first substrate; a second substrate disposed on the first substrate; and a plurality of light sources disposed on the second substrate, wherein at least two light source arrays are provided, in each of which a plurality of the light sources are disposed in a row, and wherein at least a first light source array and a second light source array among the light source arrays are individually driven.

Lamp unit and lighting system for vehicle

Disclosed is a light emitting module. The light emitting module includes a substrate and a plurality of light emitting devices disposed on the substrate, at least one of the plurality of light emitting devices includes a plurality of light emitting cells which are individually driven, and the plurality of light emitting cells include a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer, and has a light emitting surface emitting light.

Embodiments relate to a light emitting device package including a package body, a light emitting structure disposed on the package body, the light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, the light emitting structure being divided into at least two light emitting cells, a support substrate located between the package body and the light emitting structure, a first electrode and a second electrode connected to each of the light emitting cells and fluorescent substances disposed respectively on the light emitting cells. At least two layers among the first conductive semiconductor layer, the active layer and the second conductive semiconductor layer included in each of the light emitting cells next to each other are electrically separated from each other.

Light emitting device package and lighting device for vehicle including the same

The lamp unit includes a first substrate, a second substrate provided over the first substrate, a light emitting device provided over the second substrate, a first conductive layer and a second conductive layer provided over the second substrate, and at least one wire electrically coupling at least one of the first conductive layer and the second conductive layer to each of the light emitting device. A protective layer is provided over the first substrate and the second substrate and surrounding the light emitting device and the at least one wire, and the upper surface of the protecting layer is located at a position above the highest point of the at least one wire.

Lamp unit

Disclosed is a light emitting device including a light emitting structure comprising a first semiconductor layer, an active layer and a second semiconductor layer, a phosphor plate disposed on the second semiconductor layer, and a bonding portion disposed between the light emitting structure and the phosphor plate, the bonding portion bonding the phosphor plate to the light emitting structure.

Disclosed herein is a semiconductor light emitting device module comprising: a substrate; at least one support disposed on a surface of the substrate; a heat transfer member disposed on the substrate and the support, the heating transfer member having a cavity formed in at least a portion of the heat transfer member; first conductive layer and second conductive layer contacting the heat transfer member via an insulating layer, the first conductive layer and the second conductive layer being electrically isolated from each other in accordance with exposure of the insulating layer or exposure of the heat transfer member; and at least one semiconductor light emitting device electrically connected to the first conductive layer and the second conductive layer, the at least one semiconductor light emitting device is thermally contacted an exposed portion of the heat transfer member.

Growing community of inventors

Seoul, South Korea

Gun Kyo Lee