Samsung Electronics Co., Ltd.

Gun-Hee Bae

Sangwoo Pae

Jinsoo Bae

Hyunggyun Noh

Il-Joo Choi

Deok-Seon Choi

A semiconductor package device includes a package substrate, an interposer on the package substrate, a semiconductor package on the interposer, and an under-fill between the interposer and the semiconductor package. The interposer includes at least one first trench at an upper portion of the interposer that extends in a first direction parallel to a top surface of the package substrate. The at least one first trench vertically overlaps an edge region of the semiconductor package. The under-fill fills at least a portion of the at least one trench.

Growing community of inventors

Seongnam-si, South Korea

Gun-Hee Bae