Hyundai Motor Company

Samsung Electronics Co., Ltd.

Kia Motors Corporation

Kia Corporation

Lg Hausys, Ltd.

Hyundai Mobis Co., Ltd.

Gmb Korea Corp.

Gun Goo Lee

Hae Kyu Lim

Yong Hwan Choi

Sung Keun Park

Jae Yeon Kim

Wan Je Cho

Yeon Ho Kim

Myungsam Kang

Chi Hoon Choi

Woon Chun Kim

Bongju Cho

Ji Hye Shim

Yong Jae Kim

Cheol Ho Choi

Younggwan Ko

Jaekul Lee

Hee June Kim

Yong Kil Kil

Tae Min Park

Seung Woo Yang

Jun Heyoung Park

Yong Hoon Yoon

Seungwan Shin

Hyuk Kang

Tae Hyun Kim

Yun Ho Kim

Jin Woo Kwak

Hyun Soo Park

Byung Soo Kim

Dong Il Kim

Kyong Hwa Song

Chang Hyun Park

Tae Hyuck Kim

Yoon Jun Lee

Dong Seok Oh

Jeong Hun Seo

Do Suck Han

Ji Woong Jung

Jun Woo Myung

Myunghwan Kim

Yong Hyun Choi

Su Whan Kim

Ki Seung Baek

Junghoon Kang

Jong Gu Lee

Shin Gyu Kim

Bo Ram Yang

Hui Tae Yang

Min Wook Kim

Hee Sung Moon

Kilwoo Lee

Jai Young An

Jae Sung Bae

Kyung Hwan Kim

Boram Yang

Ji Eun Woo

Hye Su Lim

Jeong Han Park

Minwook Kim

Jeong Yeop Woo

Chan Woo Park

Jun Gul Hwang

Tae Gwan Heo

Woonchun Kim

Eunsil Kim

Seunghan Sim

A semiconductor package including a first redistribution structure including a first redistribution layer disposed therein, a first semiconductor chip disposed on the first redistribution structure, an insulating layer surrounding a sidewall of the first semiconductor chip, the insulating layer spaced apart from the first semiconductor chip in a horizontal direction, a first connection structure extending through the insulating layer in a vertical direction, connected to the first redistribution structure, and includes a first via disposed inside the insulating layer. A second connection structure disposed between the first semiconductor chip and the first connection structure, extends through the insulating layer in the vertical direction, connected to the first redistribution structure, and includes a second via disposed inside the insulating layer. A molding layer covering the first semiconductor chip, a sidewall and an upper surface of the insulating layer. At least a portion of the molding layer disposed between the first and second vias.

Semiconductor package and method for manufacturing the same

An integrated device of a pump and a valve is disclosed. The integrated device of a pump and a valve includes a drive unit, a valve assembly mounted on the drive unit and configured to be switchable to a first position or a second position by the drive unit, a pump mounted on the drive unit, and a controller configured to control operation of the drive unit and the pump. The valve assembly includes a plurality of inlets and a plurality of outlets. At the first position and the second position of the valve assembly, different fluid passages are formed in the valve assembly. The pump is configured to communicate with the valve assembly to allow a flow of fluid through the valve assembly.

Integrated device of pump and valve

An electric water pump is configured to reduce an axial distance between a stator and a rotor. Since a separator of a stator casing is formed so as not to cover an upper surface of a stator, the axial thickness of the separator is reduced and the axial distance between the stator and the rotor is also reduced. The reduction in the axial distance allows a motor to have increased output and efficiency.

Electric water pump

A semiconductor package includes: a lower redistribution structure including a lower insulating layer and a lower redistribution layer; a semiconductor chip disposed on the lower redistribution structure; connection conductors connected to the lower redistribution layer; an encapsulant disposed on the connection conductors; and an upper redistribution structure including an upper insulating layer and upper redistribution layers, wherein the upper insulating layer is disposed on the encapsulant, wherein the upper redistribution layers are disposed on the upper insulating layer, wherein the connection conductors and the encapsulant form a first step, wherein the upper redistribution layers include first and second upper redistribution layers, wherein the first upper redistribution layer does not overlap the connection conductors, wherein the second upper redistribution layer overlaps the connection conductors, wherein the first and second upper redistribution layers form a second step with a height substantially equal to or smaller than that of the first step.

Semiconductor package including an encapsulant

A method of manufacturing a semiconductor package includes forming an insulating layer; forming a seed layer on the insulating layer; forming a photoresist layer on the seed layer; forming a plurality of line pattern holes by patterning the photoresist layer, a horizontal length of a middle portion of each of the plurality of line pattern holes being less than a horizontal length of an upper portion of each of the plurality of line pattern holes and a horizontal length of a lower portion of each of the plurality of line pattern holes; and forming a redistribution line pattern by performing a plating process using a portion of the seed layer exposed by the plurality of line pattern holes.

Semiconductor package and method of manufacturing the same

An electrified vehicle includes: a battery; a motor drive device configured to drive a motor through an inverter, based on a voltage of the battery; and a battery controller configured to determine whether to perform output limiting on the battery, based on whether a ratio of regenerative braking is less than or equal to a preset ratio, wherein the ratio of regenerative braking is varied according to an amount of charging of the battery and an amount of discharging of the battery within a preset time interval, and adjust, based on the output limiting being performed on the battery, a derate ratio associated with a battery output limit value.

Electrified vehicle

A semiconductor package includes; a first redistribution structure including first redistribution conductors, a semiconductor chip on the first redistribution structure and including connection pads electrically connecting the first redistribution conductors, a connection conductor on the first redistribution structure, laterally spaced apart from the semiconductor chip, and electrically connected to the first redistribution conductors, an encapsulant on the first redistribution structure and sealing the semiconductor chip and at least a portion of the connection conductor, a barrier layer extending along an upper surface of the encapsulant, and a second redistribution conductor on the barrier layer and penetrating the barrier layer to contact the connection conductor.

Semiconductor package and method of manufacturing same

A cooling system for electric vehicles, which enables air to be efficiently removed from a cooling circuit due to optimal placement of a reservoir tank, includes a first cooling circuit configured to cool a battery by coolant that circulates in accordance with operation of a first circulation pump and exchanges heat with a first heat exchange module, a second cooling circuit configured to cool a PE module using coolant that circulates in accordance with operation of a second circulation pump and exchanges heat with a second heat exchange module, the second cooling circuit being configured so that the coolant in the first cooling circuit circulates through the second cooling circuit, and a reservoir tank, which is continuously connected to the first and second cooling circuits to remove air in the coolant flowing through each of the first and second cooling circuits in the reservoir tank.

Cooling system for electric vehicles

A battery cooling system includes: a heating element for performing a resistance function of a battery to be subjected to a cooling test; a heating-load controller for controlling a heating load of the heating element according to a thermal model; an environment controller for controlling at least one battery cooling environment parameter such as outdoor temperature and initial temperature; a power supply for applying a current for each evaluation condition by connecting a charger/discharger to the heating element; a cooling processing part for supplying a cooling fluid such as air, coolant, or a refrigerant at a constant temperature and flow rate; and a cooling performance determination part for measuring a temperature of a battery cell over time and determining whether a target performance of the battery is satisfied.

Battery cooling system and method for generating thermal model thereof

A fan-out semiconductor package includes a first connection structure having first and second surfaces, a first semiconductor chip disposed on the first surface, a first encapsulant disposed on the first surface and covering at least a portion of the first semiconductor chip, a second semiconductor chip disposed on the second surface, one or more first metal members disposed on the second surface, one or more second metal members disposed on the second surface, a second encapsulant disposed on the second surface and respectively covering at least portions of the second semiconductor chip and the first and second metal members, and a second connection structure disposed on an opposite side of a side of the second encapsulant, on which the first connection structure is disposed.

Fan-out semiconductor package

A heat exchanger with a thermoelectric module according to the present disclosure includes: a first heat exchanger including a first heat sink provided with a first base plate and first heat dissipation pins, a first thermoelectric module located over the first heat sink and performing heat absorption and heat dissipation, a plate-shaped first cooling plate located over the first thermoelectric module and having a flow channel through which coolant flows, and a first cover covering top of the first cooling plate; and a second heat exchanger having the same structure as the first heat exchanger and located under the first heat exchanger to be symmetrical with the first heat exchanger.

Heat exchanger with thermoelectric module and system for managing heat of battery including same

A thermal management system of a vehicle electric power system allows a production cost of a system to be reduced by reducing the number of three-way valves when compared to a conventional system and, simultaneously, is capable of implementing cooling and heating performances equivalent to those of the conventional system.

Thermal management system of vehicle electric power system

An apparatus of cooling a vehicle battery is provided. A battery module includes a module housing having an open bottom portion, with an accommodation space for accommodating a plurality of battery cells in the accommodation space, and a plurality of battery cells accommodated in the accommodation space of the module housing, with bottom surfaces of the plurality of battery cells being exposed through the open bottom portion of the module housing. A lower housing has an accommodation space in which the battery module is accommodated. The lower housing includes a cooling unit cooling the battery module and is configured for being attached to a bottom portion of a vehicle floor. Heat-conductive filler is applied on a seating surface of the lower housing, on which the plurality of battery cells are accommodated, to be in contact with the bottom surfaces of the plurality of battery cells exposed externally through the bottom portion of the module housing.

Apparatus for cooling vehicle battery and fabrication method thereof

A method of detecting a leakage of a coolant in a battery cooling device for a vehicle includes: receiving, by a controller, a first pressure value from a first pressure sensor configured to detect a pressure in a coolant pipe; and determining, by the controller, whether the coolant leaks in the coolant pipe based on the first pressure value.

Method and apparatus for detecting leakage of coolant in battery cooling device for vehicle

A system and method for thermally managing a battery, capable of effectively performing thermal management (cooling or heating) of a battery is provided. The system for thermally managing a battery includes a thermal manager performing a thermal management of a battery by means of a coolant, a coolant circulation line being connected to the thermal manager, and a heat exchanger being installed to the coolant circulation line.

System and method for thermally managing battery

Growing community of inventors

Suwon-si, South Korea

Gun Goo Lee