Xerox Corporation

Other

Palo Alto Research Center Inc.

Guiqin Song

Gordon Sisler

Nan-Xing Hu

Suxia Yang

Marcel Philippe Breton

T Brian McAneney

Qi Zhang

Edward Graham Zwartz

Biby Esther Abraham

Sarah Jane Vella

Yu Qi

Carolyn Patricia Moorlag

Brynn Mary Dooley

Valerie M Farrugia

Nicoleta D Mihai

Naveen Chopra

James Daniel Mayo

Sandra J Gardner

Kurt I Halfyard

Chu-Heng Liu

Barkev Keoshkerian

Ping Liu

Chad Steven Smithson

Gabriel Iftime

Cuong Vong

Michelle Chretien

Jingsong Tang

Santokh Singh Badesha

Yiliang Wu

Peter Gordon Odell

Stephan V Drappel

Linn C Hoover

C Geoffrey Allen

Ping Mei

Adela Goredema

George Amos Gibson

Gregory Lewis Whiting

Gregory McGuire

Adrien Pierre Cote

Mihaela Maria Birau

Yvan Gagnon

Yu Liu

Tie Hwee Ng

Frank Ping-Hay Lee

Richard Andrew Klenkler

Sheau V Kao

David P Van Bortel

Yujie Zhu

Jyothsna Ram

John Viavattine

Samantha M Roland

Xan-Xing Hu

Nicoleta Mihai

John M Viavattine

Provided herein is a composition for eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers and at least one organoamine stabilizer. Also provided herein is a process for preparing eutectic metal alloy nanoparticles comprising mixing at least one organic polar solvent, at least one organoamine stabilizer, and a eutectic metal alloy to create a mixture; sonicating the mixture at a temperature above the melting point of the eutectic metal alloy; and collecting a composition comprising a plurality of eutectic metal alloy nanoparticles having an average particle size ranging from about 0.5 nanometers to less than about 5000 nanometers. Further disclosed herein are hybrid conductive ink compositions comprising a component comprising a plurality of metal nanoparticles and a component comprising a plurality of eutectic metal alloy nanoparticles.

Compositions comprising eutectic metal alloy nanoparticles

Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of metal nanoparticle shaving an average particle size ranging from about 0.5 nanometers to about 100 nanometers, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

Adhesive composition comprising metal nanoparticles

A temperature sensitive ink composition including a metal oxide nanoparticle; a binder; a solvent; an optional dispersant; and an optional surfactant; wherein the ink composition is a thermistor ink that exhibits a change in resistance which is dependent on temperature. A process for preparing the ink composition. A process including depositing the ink composition onto a substrate to form deposited features; and optionally, heating the deposited features on the substrate to form temperature sensitive features on the substrate, wherein depositing can include ink jet printing or aerosol jet printing.

Temperature sensor ink composition with metal oxide nanoparticles

Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparticles, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

Adhesive composition comprising eutectic metal alloy nanoparticles

Conductive adhesive compositions, jettable ink adhesive compositions, printed electronics incorporating the conductive adhesive compositions, and methods for preparing the same are provided. The conductive adhesive composition may include a eutectic metal alloy, an amine, and a solvent, and the eutectic metal alloy may include gallium, indium, and optionally tin.

Conductive adhesive compositions and method for the same

UV-curable interlayer compositions are provided. In embodiments, the interlayer composition comprises at least one aliphatic di(meth)acrylate monomer diluent having a dynamic viscosity at 25&#xb0; C. of less than about 100 cps; at least one (meth)acrylate oligomer selected from epoxy (meth)acrylates, polyester (meth)acrylates, polyether (meth)acrylates, urethane (meth)acrylates and combinations thereof, the at least one (meth) acrylate oligomer having a glass transition temperature in the range of from about minus 10&#xb0; C. to about 100&#xb0; C. and a dynamic viscosity at 25&#xb0; C. of less than about 3000 cps; and at least two photoinitiators. Multilayer structures formed using the compositions and related methods are also provided.

UV curable interplayer for electronic printing

An aqueous sacrificial coating composition for an image transfer member in an aqueous ink imaging system is provided. The sacrificial coating composition may include at least one polymer, at least one selected from (i) at least one chain extender, or (ii) a reactive elastomeric latex, wherein the at least one chain extender comprises a species capable of linking linear chains or chain segments of the reactive elastomeric latex, at least one hygroscopic plasticizer, and at least one surfactant.

Compositions and use of compositions in printing processes

An embodiment of the present disclosure is directed to a sacrificial coating composition for an image transfer member in an aqueous ink imaging system. The coating composition is made from ingredients including: a latex having polymer particles dispersed in a continuous liquid phase; at least one hygroscopic material; at least one oil-in-water emulsion; and at least one surfactant.

Sacrificial coating for intermediate transfer member of an indirect printing apparatus

UV-curable interlayer compositions are provided. In embodiments, the interlayer composition comprises at least one aliphatic di(meth)acrylate monomer diluent having a dynamic viscosity at 25&#xb0; C. of less than about 100 cps; at least one (meth)acrylate oligomer selected from epoxy (meth)acrylates, polyester (meth)acrylates, polyether (meth)acrylates, urethane (meth)acrylates and combinations thereof, the at least one(meth) acrylate oligomer having a glass transition temperature in the range of from about minus 10&#xb0; C. to about 100&#xb0; C. and a dynamic viscosity at 25&#xb0; C. of less than about 3000 cps; and at least two photoinitiators. Multilayer structures formed using the compositions and related methods are also provided.

UV curable interlayer for electronic printing

The present disclosure is directed to a composition including a polyvinyl butyral represented by the following formula: wherein A, B and C represent a proportion of corresponding repeat units expressed as a weight percent, wherein each repeat unit is randomly distributed along a polymer chain and wherein the sum of A, B and C is about 100 weight percent; a poly(melamine-co-formaldehyde) based polymer and an anhydride. Devices coated with the composition and cured films formed from the composition comprising conductive features are also provided.

Interlayer composition for electronic printing

A process for preparing a device and a device including a substrate; an interlayer disposed on the substrate, wherein the interlayer comprises a cured film formed from an interlayer composition, wherein the interlayer composition comprises: an epoxy compound; a polyvinyl phenol; a melamine resin; a solvent; an optional surfactant; and an optional catalyst; a source electrode and a drain electrode disposed on a surface of the interlayer; a semiconductor layer disposed on the interlayer, wherein the semiconductor layer is disposed into a gap between the source and drain electrode; a back channel interface comprising an interface between the semiconductor layer and the interlayer, wherein the interlayer serves as a back channel dielectric layer for the device; a dielectric layer disposed on the semiconductor layer; a gate electrode disposed on the dielectric layer. Also an interlayer composition and an organic thin film transistor comprising the interlayer composition.

Device comprising dielectric interlayer

UV-curable interlayer compositions are provided. An interlayer composition may contain a polyallyl isocyanurate compound, an ester of &#x3b2;-mercaptopropionic acid, a monofunctional (meth)acrylate monomer having one or more cyclic groups, and a photoinitiator. Processes of using the interlayer compositions to form multilayer structures and the multilayer structures are also provided.

UV curable interlayer composition for printed electronics application

Growing community of inventors

Milton, Canada

Guiqin Song