Average Co-Inventor Count = 3.67
ph-index = 22
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Adeia Semiconductor Bonding Technologies Inc. (95 from 1,843 patents)
2. Ford Global Technologies, LLC (4 from 25,606 patents)
3. Ford Motor Company Limited (4 from 6,146 patents)
4. Other (1 from 831,952 patents)
5. Zeevo, Inc. (1 from 13 patents)
6. Invensas Bonding Technologies, Inc. (1 from 5 patents)
7. Panasonic Precision Devices Co., Ltd. (1 from 3 patents)
107 patents:
1. 12406959 - Post CMP processing for hybrid bonding
2. 12406975 - Techniques for processing devices
3. 12381119 - Seal for microelectronic assembly
4. 12381128 - Structures with through-substrate vias and methods for forming the same
5. 12374556 - Processing stacked substrates
6. 12341125 - Dimension compensation control for directly bonded structures
7. 12322667 - Seal for microelectronic assembly
8. 12300662 - DBI to SI bonding for simplified handle wafer
9. 12272677 - Direct bonded stack structures for increased reliability and improved yield in microelectronics
10. 12271032 - Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
11. 12266640 - Molded direct bonded and interconnected stack
12. 12261099 - Embedded cooling systems with coolant channel for device packaging
13. 12243851 - Offset pads over TSV
14. 12205926 - TSV as pad
15. 12191233 - Embedded cooling systems and methods of manufacturing embedded cooling systems