Average Co-Inventor Count = 3.65
ph-index = 22
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Adeia Semiconductor Bonding Technologies Inc. (97 from 1,851 patents)
2. Ford Global Technologies, LLC (4 from 25,757 patents)
3. Ford Motor Company Limited (4 from 6,148 patents)
4. Other (1 from 832,398 patents)
5. Zeevo, Inc. (1 from 13 patents)
6. Invensas Bonding Technologies, Inc. (1 from 5 patents)
7. Panasonic Precision Devices Co., Ltd. (1 from 3 patents)
109 patents:
1. 12438122 - DBI to Si bonding for simplified handle wafer
2. 12417950 - Mitigating surface damage of probe pads in preparation for direct bonding of a substrate
3. 12406959 - Post CMP processing for hybrid bonding
4. 12406975 - Techniques for processing devices
5. 12381119 - Seal for microelectronic assembly
6. 12381128 - Structures with through-substrate vias and methods for forming the same
7. 12374556 - Processing stacked substrates
8. 12341125 - Dimension compensation control for directly bonded structures
9. 12322667 - Seal for microelectronic assembly
10. 12300662 - DBI to SI bonding for simplified handle wafer
11. 12272677 - Direct bonded stack structures for increased reliability and improved yield in microelectronics
12. 12271032 - Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
13. 12266640 - Molded direct bonded and interconnected stack
14. 12261099 - Embedded cooling systems with coolant channel for device packaging
15. 12243851 - Offset pads over TSV