Average Co-Inventor Count = 3.67
ph-index = 22
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Adeia Semiconductor Bonding Technologies Inc. (98 from 1,853 patents)
2. Ford Global Technolgoies, LLC (4 from 25,913 patents)
3. Ford Motor Company Limited (4 from 6,151 patents)
4. Other (1 from 832,718 patents)
5. Zeevo, Inc. (1 from 13 patents)
6. Invensas Bonding Technologies, Inc. (1 from 5 patents)
7. Panasonic Precision Devices Co., Ltd. (1 from 3 patents)
110 patents:
1. 12482776 - Metal pads over TSV
2. 12438122 - DBI to Si bonding for simplified handle wafer
3. 12417950 - Mitigating surface damage of probe pads in preparation for direct bonding of a substrate
4. 12406959 - Post CMP processing for hybrid bonding
5. 12406975 - Techniques for processing devices
6. 12381119 - Seal for microelectronic assembly
7. 12381128 - Structures with through-substrate vias and methods for forming the same
8. 12374556 - Processing stacked substrates
9. 12341125 - Dimension compensation control for directly bonded structures
10. 12322667 - Seal for microelectronic assembly
11. 12300662 - DBI to SI bonding for simplified handle wafer
12. 12272677 - Direct bonded stack structures for increased reliability and improved yield in microelectronics
13. 12271032 - Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
14. 12266640 - Molded direct bonded and interconnected stack
15. 12261099 - Embedded cooling systems with coolant channel for device packaging