Average Co-Inventor Count = 3.67
ph-index = 22
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Adeia Semiconductor Bonding Technologies Inc. (96 from 1,847 patents)
2. Ford Global Technologies, LLC (4 from 25,684 patents)
3. Ford Motor Company Limited (4 from 6,147 patents)
4. Other (1 from 832,347 patents)
5. Zeevo, Inc. (1 from 13 patents)
6. Invensas Bonding Technologies, Inc. (1 from 5 patents)
7. Panasonic Precision Devices Co., Ltd. (1 from 3 patents)
108 patents:
1. 12417950 - Mitigating surface damage of probe pads in preparation for direct bonding of a substrate
2. 12406959 - Post CMP processing for hybrid bonding
3. 12406975 - Techniques for processing devices
4. 12381119 - Seal for microelectronic assembly
5. 12381128 - Structures with through-substrate vias and methods for forming the same
6. 12374556 - Processing stacked substrates
7. 12341125 - Dimension compensation control for directly bonded structures
8. 12322667 - Seal for microelectronic assembly
9. 12300662 - DBI to SI bonding for simplified handle wafer
10. 12272677 - Direct bonded stack structures for increased reliability and improved yield in microelectronics
11. 12271032 - Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
12. 12266640 - Molded direct bonded and interconnected stack
13. 12261099 - Embedded cooling systems with coolant channel for device packaging
14. 12243851 - Offset pads over TSV
15. 12205926 - TSV as pad