Nubis Communications, Inc.

Alcatel Lucent

Nokia Solutions and Networks Oy

Nokia of America Corporation

Alcatel-Lucent USA Inc.

Lumentum Operations LLC

Guilhem De Valicourt

Peter Johannes Winzer

Peter James Pupalaikis

Clinton Randy Giles

Brett Michael Dunn Sawyer

Ron Zhang

Michael Scott Eggleston

Jonathan Proesel

Po Dong

Romain Brenot

Yvan Pointurier

Michael Eggleston

Chia-Ming Chang

Sian Chong Jeffrey Lee

Carlo Ferrari

Maarten Huberdina Pascal Tytgat

Michael Kossey

An apparatus includes a rackmount device, in which the rackmount device includes a housing configured to be installed in a server rack, in which the housing has a width in a range from 16 to 20 inches and a height in a range from 1 to 12 inches, the housing includes a front panel, a rear panel, and a bottom surface. The rackmount device includes a first circuit board or substrate having a first surface that defines a length and a width of the first circuit board or substrate, in which the first circuit board or substrate is positioned relative to the housing such that the first surface of the first circuit board or substrate is at an angle relative to the bottom surface of the housing, and the angle is in a range from 45° to 90°. At least one of (i) the front panel of the housing is formed at least in part by the first circuit board or substrate, (ii) the first circuit board or substrate is attached to the front panel of the housing, or (iii) the first circuit board or substrate is substantially parallel to the front panel of the housing. The rackmount device includes at least one data processor electrically coupled to the first circuit board or substrate and configured to process data; and at least one optical/electrical communication interface coupled to the first circuit board or substrate and configured to convert received optical signals to electrical signals that are provide to the at least one data processor. The rackmount device includes at least one of (i) at least one inlet fan attached to the front panel of the housing, or (ii) at least one fan positioned near the front panel in which at least a portion of a fan blade of the at least one fan is within a first distance from the front panel for at least some time period during operation of the at least one fan, and the first distance is less than one-fourth of a second distance between the front panel and the rear panel.

Thermal design for rack mount systems including optical communication modules

A system includes a housing and a first circuit board positioned inside the housing. The housing has a top panel, a bottom panel, a left side panel, a right side panel, a front panel, and a rear panel. The front panel is at an angle relative to the bottom panel in which the angle is in a range from 30 to 150°. The first circuit board has a length, a width, and a thickness, in which the length is at least twice the thickness, the width is at least twice the thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is at a first angle relative to the bottom panel in which the first angle is in a range from 30 to 150°. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°. The system includes a first data processing module and a first optical interconnect module both electrically coupled to the first circuit board. The optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.

Data processing systems including optical communication modules

An apparatus includes: at least one of a circuit board or a substrate; and a first structure attached to the at least one of a circuit board or a substrate. The first structure is configured to enable an optical module with connector to be removably coupled to the first structure, and the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector. For example, the circuit board or the substrate includes first electrical contacts, the first structure includes walls that define a first opening, the walls also define one or more retaining mechanisms such that when the optical module with connector is inserted into the first opening, the one or more retaining mechanisms on the walls of the first structure engage one or more latch mechanisms on the optical module with connector to secure the optical module with connector to the first structure, and second electrical contacts on the optical module with connector are electrically coupled to the first electrical contacts on the circuit board or the substrate.

A method and system for forming a photonic device. A photonic device may include a substrate, a cladding layer disposed on the substrate, an electrical device region formed within the cladding layer, the electrical device region having a plurality of electrical device component layers that include at least one metal layer, and a grating region formed within the cladding layer, the grating region including a grating coupler and the at least one metal layer. The at least one metal layer is deposited simultaneously in the electrical device and grating regions and is used in the grating region to reflect light emitted from the grating coupler.

High efficiency vertical grating coupler for flip-chip application

A system includes a housing and a first circuit board positioned inside the housing. The housing has top, bottom, left side, right side, front, and rear panels. The first circuit board has a length, a width, and a thickness, and the first circuit board has a first surface defined by the length and the width. The first surface of the first circuit board is substantially parallel to the front panel or at a second angle relative to the front panel in which the second angle is less than 60°. The system includes a first data processing module and a first optical interconnect module both electrically coupled to the first circuit board. The optical interconnect module is configured to receive first optical signals from a first optical link, convert the first optical signals to first electrical signals, and transmit the first electrical signals to the first data processing module.

A mode-locked semiconductor laser capable of changing the spacing between the carrier frequencies of its output comb. In an example embodiment, the mode-locked semiconductor laser is implemented as a hybrid solid-state device comprising a III-V semiconductor chip and a silicon chip attached to one another to form a laser cavity. The III-V semiconductor chip includes a gain medium configured to generate light in response to being electrically and/or optically pumped. The silicon chip includes a plurality of optical waveguides arranged to provide multiple optical paths of different effective lengths for the light generated in the laser cavity. Different optical paths can be controllably selected, using one or more optical switches connected between the optical waveguides, to change the effective optical length of the laser cavity and, as a result, the output-comb frequency spacing. In some embodiments, the output-comb frequency spacing can be changeable at least by a factor of 1.5.

Mode-locked semiconductor laser capable of changing output-comb frequency spacing

A directly modulated semiconductor laser whose optical output can be modulated by varying the transmittance of an end reflector of the laser cavity. In an example embodiment, the end reflector can be implemented using a lightwave circuit in which optical waveguides are arranged to form an optical interferometer. At least one of the optical waveguides may include a waveguide section configured to modulate the phase of an optical beam passing therethrough in response to an electrical radio-frequency drive signal in a manner that causes the transmittance and reflectance of the end reflector to be modulated accordingly. Advantageously, relatively high (e.g., &#x3e;10 GHz) phase and/or amplitude modulation speeds of the optical output can be achieved in this manner to circumvent the inherent modulation-speed limitations of the laser's gain medium.

Directly modulated laser having a variable light reflector

An apparatus includes an optical amplifier waveguide and an optical reflector located to reflect back some light received at or near a first end of the optical amplifier waveguide. The apparatus also includes another optical waveguide having a first end located to receive light at or near a second end of the optical amplifier waveguide, and the another optical waveguide having a sequence of optical ring resonators optically connected there along with each of the optical ring resonators being configured to have a different free spectral range. A system and a method are also included.

Increasing fabry-perot cavity free spectral range in hybrid lasers

A dual-drive push-pull Mach-Zehnder modulator is provided that suppresses electrical common-mode signal components using differential input in order to mitigate parasitic phase shift effects. The modulator is configured with at least two phase shifting sections with each having a respective set of diodes. Drive signals for each phase shifter are swapped by swapping two waveguide arms in which the first and second set of diodes are constructed in a particular configuration such that the electric field applied by each drive signal in the second set of diodes is the negative of what such signal was in the first set of set of diodes. As the input optical signal propagates through the first waveguide arm and the second waveguide arm, each arm independently modulates the phase which are then re-combined to provide an optical output signal with at least one suppressed signal component.

Dual-drive push-pull optical modulator with electrical common-mode suppression

An exemplary apparatus is provided for an optical node of an optical ring network. The optical node comprises a main branch with a wavelength blocker configured to block at least one wavelength of signals targeted to a particular node and to permit the signals received on the other wavelength channels pass, a reception unit tuned to the at least one wavelength dedicated to signals targeted to the particular node, a first optical coupler configured to transmit the signals received from a previous node of the optical ring network both to the main branch and to the reception unit, a transmission unit configured to transmit signals to a wavelength channel according to their targeted node, and a second optical coupler configured to receive the signals received from the main branch and from the transmission unit and to transmit the received signals toward a next node of the optical ring network.

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Jersey City, NJ, United States of America

Guilhem De Valicourt