Koninklijke Philips Corporation N.v.

Asml Netherlands B.v.

Lumileds Holding B.v.

Guido Salmaso

Hans-Helmut Bechtel

Oleg Borisovich Shchekin

April Dawn Schricker

Kenneth John Vampola

Paul Janssen

Pieter-Jan Van Zwol

Maxim Aleksandrovich Nasalevich

Dennis De Graaf

Michael Alfred Josephus Kuijken

Thijs Kater

Jan Hendrik Willem Kuntzel

Kevin Kornelsen

Maxime Biron

Richard Beaudry

Stephane Martel

Kenneth Vampola

A wafer including a mask on one face and at least one layer on an opposite face, wherein the mask has at least one scribeline which overlies at least a portion of the opposite face which is substantially free of the at least one layer is described. Also described is a method of preparing a pellicle, the method including: providing a wafer having a mask on one face and at least one layer on an opposite face, defining a scribeline in the mask, and selectively removing a portion of the at least one layer which at least partially overlies the scribeline as well as a method of preparing a pellicle, the method including: providing a pellicle core, and removing at least some material from at least one face of the pellicle core in a non-oxidising environment. In any aspect, the pellicle may include a metal nitride layer.

Pellicle for EUV lithography

A method according to embodiments of the invention includes disposing a support layer () on a surface of a wavelength converting ceramic wafer (). The wavelength converting ceramic wafer and the support layer are diced () to form wavelength converting members. A wavelength converting member is attached to a light emitting device. After attaching the wavelength converting member to the light emitting device, the support layer is removed.

Method of forming a wavelength converted light emitting device

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Eindhoven, Netherlands

Guido Salmaso