Asm Technology Singapore Pte Ltd

Fei Comapny

Guido Knippels

Mark Utlaut

Milos Toth

Marcus Straw

David H Narum

Gerardus Nicolaas Anne Van Veen

Rogier Evertsen

Richard Van Lieshout

Jianfei Yang

Eric Meng Meng Tan

Marcel Boeren

Frank Ernst

Raph Pieters

Geert Ubink

Mark Müller

Laser processing is enhanced by using endpointing or by using a charged particle beam together with a laser. End-pointing uses emissions, such as photons, electrons, ions, or neutral particles, from the substrate to determine when the material under the laser has changed or is about to change. Material removed from the sample can be deflected to avoid deposition onto the laser optics.

Method and apparatus for laser machining

A wafer grooving apparatus () for forming an elongate recess () in a semiconductor wafer surface, the apparatus comprising: a wafer table () for receiving and holding a semiconductor wafer; a radiation device () for generating a radiation beam (); a beam directing device () for directing the radiation beam to a top surface () of the wafer so as to create a beam spot () where the radiation beam ablates wafer material on the wafer surface to form a recess; a wafer table displacement drive () for effecting a mutual displacement between the radiation beam and the wafer surface in a radiation beam displacement direction; a recess profile measuring device () arranged at a predetermined distance behind the beam directing device in the radiation beam displacement direction effected by the wafer table displacement drive for measuring a depth profile of the recess that has been formed by the radiation beam.

Method and device for grooving wafers

A wafer cutting apparatus comprises a wafer positioning device for holding a wafer that is substantially covered with an opaque material such as molding compound and that has an exposed peripheral area, and for displacing the wafer relative to a wafer inspection system comprising a camera having a field of view. To perform visual data acquisition of said dicing street portions, the wafer is displaced such that a center of the camera's field of view follows a path along the exposed peripheral area of the wafer. A processing unit analyzes the visual data acquired for detecting or calculating locations and directions of the dicing streets. A wafer cutting tool cuts the wafer along straight lines between the dicing street portions which have been detected or calculated by the processing unit.

Apparatus and method for cutting a wafer that is substantially covered by an opaque material

A method of singulating a semiconductor wafer with laser energy while the semiconductor wafer is supported on a mounting tape during singulation comprises the step of depositing a coating material onto a portion of the mounting tape adjacent to a perimeter of the semiconductor wafer to form a protective layer over the mounting tape. The semiconductor wafer is then cut with a laser beam such that the laser beam at least partially impinges upon the protective layer during cutting of the semiconductor wafer. After singulation of the semiconductor wafer, the protective layer is removed from the mounting tape.

Method of protecting a mounting tape during laser singulation of a wafer

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Schijndel, Netherlands

Guido Knippels