Melexis Technologies Sa

Guido Dupont

Lionel Tombez

Robert Racz

Jian Chen

Simon Houis

Bruno Boury

Antonino Cacciato

Stephane Rauw

Adrian Hill

Nicolas Tribie

Paul Laval

The present invention relates to a current sensor device comprising: current sensing means for sensing a current, a circuit arranged to convert a signal received from the current sensing means into a signal indicative of the sensed current, storage means for storing a plurality of values of the signal indicative of the sensed current, a processing circuit arranged for receiving a subset of the plurality of values stored in the storage means, for detecting or predicting an event based on a function of the subset, said function being stored in the storage means, and for generating a corresponding event signal, said current supervisory device further comprising an interface circuit arranged to output the corresponding event signal.

Device for supervising a sensed current

An electronic circuit device for acquiring an analog signal. The device comprising: a data line, one or more control lines (of which at least a clock line, and configured for transmitting a stored digital measurement result using the data line and the one or more control lines, in accordance with a synchronous serial communication protocol; a detection means for recognizing a synchronization pulse on one of the one or more control lines or on the data line; wherein the device is configured for repetitively measuring the analog signal or for measuring the analog signal triggered by the synchronization pulse; and for storing one or more digital measurement results or combinations thereof when triggered by the synchronization pulse.

Synchronous electronic circuit devices

A current sensor comprises a current conductor having a first portion, a measuring portion and a second portion, the first portion including one or more first electrical terminals and the second portion including one or more second electrical terminals. The current sensor further comprises third electrical terminals and a semiconductor chip. The semiconductor chip has one or more magnetic field sensors disposed in the active surface, is mounted on the current conductor with an active surface facing the current conductor. The active surface comprises first contacts. The semiconductor chip comprises electrical through silicon connections disposed over and electrically connected to the first contacts. A backside of the semiconductor chip comprises second contacts, each of the second contacts electrically connected to one of the electrical through silicon connections. Wire bonds electrically connect the second contacts with the third electrical terminals.

Current sensor and method of making a current sensor

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Bevaix, Switzerland

Guido Dupont