Mapper Lithography IP B.v.

Asml Netherlands B.v.

Guido De Boer

Niels Vergeer

Marcel Nicolaas Jacobus Van Kervinck

Godefridus Cornelius Antonius Couweleers

Stijn Willem Herman Karel Steenbrink

Vincent Sylvester Kuiper

Erwin Slot

Hendrik Jan De Jong

Pieter Kruit

Kaustubh Prabodh Padhye

Johnny Joannes Jacobus Van Baar

Laurens Vincent Plandsoen

Teunis Van De Peut

Ralph Van Melle

Frederik Matthias Spiegelhalder

Thomas Adriaan Ooms

Marco Jan-Jaco Wieland

Alexander Hendrik Vincent Van Veen

Michel Pieter Dansberg

Robert Mossel

Jerry Peijster

Henk Derks

Cor Verburg

Edwin Johannes Theodorus Smulders

Roy Josephus Stephanus Derks

Remco Jager

Marco Jan Jaco Wieland

Stijn Willem Karel Herman Steenbrink

Aukje Arianne Annette Kastelijn

Thomas Adrian Ooms

Jerry Johannes Martinus Peijster

Tijs Frans Teepen

Pieter Kappelhof

Alexius Otto Looije

Sander Baltussen

Alrik Van Den Brom

Hugo Martijn Makkink

Joep Gerard Vijverberg

Rogier Martin Lambert Ellenbroek

Bas Van Gelder

Michel Dansberg

Cornelis Verburg

Joris Anne Henri Van Nieuwstadt

Willem Maurits Weeda

The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target () such as a wafer, said target being included in said system by means of a target table (), clamping means being present for clamping said target on said table. Said clamping means comprises a layer of stationary liquid (), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target () and target table (), a pressure drop (P) arises.

Lithography system, method of clamping and wafer table

An apparatus for transferring a target, such as a substrate or a substrate support structure onto which a substrate has been clamped, from a substrate transfer system to a vacuum chamber of a lithography system. The apparatus comprises a load lock chamber for transferring the target into and out of the vacuum chamber. The load lock chamber comprises a first wall with a first passage providing access between a robot space and the interior of the load lock chamber, a second wall with a second passage providing access between the interior of the load lock chamber and the vacuum chamber, and plurality of handling robots for transferring the targets comprising: a first handling robot movable within the robot space to access the substrate transfer system and the first passage; and a second handling robot movable within the load lock chamber to access the first passage and the second passage.

Apparatus for transferring a substrate in a lithography system

A method for forming an optical fiber array. A substrate having a first surface and an opposing second surface is provided. The substrate is provided with a plurality of apertures extending through the substrate from the first surface to the second surface. In addition, a plurality of fibers are provided. The fibers have fiber ends with a diameter smaller than the smallest diameter of the apertures. A first fiber is inserted in a first corresponding aperture, from the first surface side of the substrate, such that the fiber end is positioned in close proximity of the second surface. The inserted first fiber is bent in a predetermined direction such that the fiber abuts a side wall of the first aperture at a predetermined position. After the first fiber is bent, a second fiber is inserted in a second corresponding aperture, from the first surface side of the substrate, such that the fiber end is positioned in close proximity of the second surface. The inserted second fiber is bent in conformity with a shape of the first fiber, such that the fiber abuts a side wall of the second aperture at a predetermined position. The bent fibers are bonded together using an adhesive material.

Method for forming an optical fiber array

The invention relates to an assembly for enclosing a target processing machine. The assembly comprises an enclosure and a transfer unit. The enclosure comprises a base plate for arranging said target processing machine thereon, side wall panels, which are fixed to said base plate, and a top wall panel which is fixed to said side wall panels. In addition, the enclosure comprises an access opening in a side wall of the enclosure. The transfer unit comprising one or more transfer elements for moving the transfer unit with respect to the base plate. The transfer unit further comprises a door panel which is arranged for closing the access opening, wherein the door panel is movably mounted to the transfer unit by means of a flexible coupling which allows a movement of the door panel with respect to the transfer unit at least in a direction towards and/or away from the enclosure.

Enclosure for a target processing machine

The invention relates to a substrate comprising an optical position mark for being read-out by an optical recording head for emitting light of predetermined wavelength, preferably red or infra-red light, more in particular of 635 nm light, the optical position mark having a mark height, a mark length and a predetermined known position on the substrate, the optical position mark extending along a longitudinal direction and being arranged for varying a reflection coefficient of the position mark along said longitudinal direction, wherein the optical position mark comprises:

Method of determining a position of a substrate in a lithography system, substrate for use in such a method, and lithography system for carrying out such method

The invention relates to a differential interferometer module adapted for measuring a direction of displacement between a reference mirror and a measurement mirror. In an embodiment the differential interferometer module is adapted for emitting three reference beams towards a first mirror and three measurement beams towards a second mirror for determining a displacement between said first and second mirror. In a preferred embodiment the same module is adapted for measuring a relative rotation around two perpendicular axes as well. The present invention further relates to a lithography system comprising such a interferometer module and a method for measuring such a displacement and rotations.

Interferometer module

The invention relates to a lithography system comprising an optical column, a moveable target carrier for displacing a target such as a wafer, and a differential interferometer module, wherein the interferometer module is adapted for emitting three reference beams towards a first mirror and three measurement beams towards a second mirror for determining a displacement between said first and second mirror. In a preferred embodiment the same module is adapted for measuring a relative rotation around two perpendicular axes as well. The present invention further relates to an interferometer module and method for measuring such a displacement and rotations.

Lithography system with differential interferometer module

The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target () such as a wafer, said target being included in said system by means of a target table (), clamping means being present for clamping said target on said table. Said clamping means comprises a layer or stationary liquid (), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target () and target table (), a pressure drop (P) arises.

A lithography system having one or more lithography elements Each lithography element has a plurality of lithography subsystems. The lithography system further has a control network forming a control network path between the plurality of the lithography subsystems and at least one element control unit for communication of control information. The lithography system is arranged for: issuing control information to the at least one element control unit to control operation of one or more of the lithography subsystems for exposure of one or more wafers; issuing a process program to the element control unit. The process program has a set of predefined commands and associated parameters. The element control unit is arranged to transmit a command of the process program to a lithography subsystem to be executed by the lithography subsystem, regardless of an execution status of a preceding command transmitted to the lithography subsystem.

Network architecture and protocol for cluster of lithography machines

The invention relates to a lithography system for processing a target, such as a wafer. The lithography system comprises a beam source arranged for providing a patterning beam, a final projection system arranged for projecting a pattern on the target surface, a chuck arranged for supporting the target and a mark position system connected to the final projection system and arranged for detecting a position mark on a surface.

Lithography system for processing a target, such as a wafer, and a method for operating a lithography system for processing a target, such as a wafer

The invention relates to a substrate for use in a lithography system, said substrate being provided with an at least partially reflective position mark comprising an array of structures, the array extending along a longitudinal direction of the mark, characterized in that said structures are arranged for varying a reflection coefficient of the mark along the longitudinal direction, wherein said reflection coefficient is determined for a predetermined wavelength. In an embodiment a specular reflection coefficient varies along the substrate, wherein high order diffractions are substantially absorbed by the substrate. A position of a beam on a substrate can thus be determined based on the intensity of its reflection in the substrate. The invention further relates to a positioning device and lithography system for cooperation with the substrate, and a method of manufacture of the substrate.

Position determination in a lithography system using a substrate having a partially reflective position mark

The invention relates to a lithography system for processing a target, wherein the lithography system comprises a final projection system arranged for projecting a pattern on the target surface. The lithography system comprises a mark position detection system arranged for detecting a position of a position mark on the target surface. The mark position detection system comprises an optical element arranged for projecting a light beam on the target surface and a light detector arranged for detecting a reflected light beam. The optical element may be positioned adjacent to the final projection system and the light detector may be positioned inside a frame.

Lithography system for processing at least a part of a target

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Leerdam, Netherlands

Guido De Boer