Jenoptik Laserdiode Gmbh

Spectra-physics Gmbh

Guido Bonati

Dirk Lorenzen

Petra Hennig

Hans-Georg Treusch

Hartmut G Haensel

Ulrich Rollig

In a diode laser module and a method for the production thereof, there is a need to fix the optical elements required for collimating, beam shaping and/or beam rearrangement of the radiation of a laser diode element with high reproducibility and long-term stability in an optically aligned manner, wherein the optically aligned state is produced by a successive adjustment of the optical elements in the beam of the switched-on laser diode element. It must be ensured that the fixing can be carried out in a process that is at least partially automated. At least one intermediate carrier is arranged on a heat-dissipating carrier serving to cool the laser diode element. The heat conductivity of the intermediate carrier is less than that of the heat-dissipating carrier, and the alignment of the optical components and fixation by sequential soldering is carried out on the surface of the intermediate carrier.

Diode laser module and method for the production thereof

The invention refers to a novel semiconductor module with at least one semiconductor element in the form of a laser diode or laser diode arrangement, whereby the semiconductor element is provided with an area of a multi-layer substrate, which at least in a partial area is designed as a micro-cooler through which cooling medium flows, and which has connectors for supplying and discharging cooling medium.

Semiconductor module

A laser bar is soldered to a conventional microchannel copper heat sink whose coefficient of thermal expansion (CTE) is locally modified in the area where the laser bar is soldered to better match the CTE of the laser bar. A strip of ceramic material having a CTE lower than that each of the laser bar and of the copper heat sink is soldered to portions of the metallic heat sink located adjacently to the surface area on which the laser bar is located. The inclusion of the ceramic strips enables a laser bar having a nominal CTE of 6.6&#xd7;10/K, to be soldered directly to a copper heat sink having a nominal CTE of 16.5&#xd7;10/K without incurring thermal distortions at the interface that would limit the useful life of the laser bar.

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Weimar, Germany

Guido Bonati