Samsung Electronics Co., Ltd.

Guesuk Lee

Ilyoung Han

Taemin Earmme

Nohsung Kwak

Seungchul Han

Youngjae Son

Jonghwi Seo

Jaehee Lee

Hyeongyun Lee

Euijin Seo

Disclosed are chuck assemblies, semiconductor device fabricating apparatuses, and methods of fabricating semiconductor devices. The chuck assembly comprises a chuck base including lower and upper bases, a ceramic plate on the upper base, an edge ring that surrounds the ceramic plate, a ground ring that surrounds an outer sidewall of the edge ring on an edge portion of the lower base, a coupling ring between the ground ring and the upper base and between the edge ring and the edge portion of the lower base, an upper heat sink between the coupling ring and the edge ring, and a sidewall heat sink between the coupling ring and the ground ring and between the coupling ring and the upper base.

Chuck assembly, semiconductor device fabricating apparatus including the same, and method of fabricating semiconductor device

A semiconductor manufacturing apparatus is provided including a beam shaper arranged on a light path of a laser beam and including a plurality of mask modules. The plurality of mask modules defines a light blocking region and a light transmitting region. At least one mask module of the plurality of mask modules includes a blocking plate configured to block a portion of the laser beam, and a driver is configured to move the blocking plate.

Semiconductor manufacturing apparatus including a beam shaper for shaping a laser beam

Growing community of inventors

Seoul, South Korea

Guesuk Lee