Siemens Aktiengesellschaft

Osram Gmbh

Patent-treuhand-gesellschaft Fuer Elektrische Gluehlampen Mbh

Osram Opto Semi-conductors Gmbh Co. Ohg

Other

Electrovac Gesmbh

Guenther Waitl

Franz Schellhorn

Herbert Brunner

Andries Ellens

Alexandra Debray

Franz Zwaschka

Franz Kummer

Hans-Ludwig Althaus

Werner Spaeth

Waltraud Klos

Rolf Birkmann

Axel Schubert

Ernst Wipfelder

Werner Kuhlmann

Ulrike Reeh

Klaus Hoehn

Karl Osojnik

Gerfried Felkel

Karl Geim

Gerhard Maier

Wolfgang Guenzel

Ewald Schmidt

Alois Karl

In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof

A phosphor for light sources, the emission from which lies in the short-wave optical spectral region, as a garnet structure ABO. It is activated with Ce, the second component B representing at least one of the elements Al and Ga, and the first component A is terbium or terbium together with at least one of the elements Y, Gd, La and/or Lu. In a preferred embodiment, a phosphor having a garnet of structure (TbRECE)(Al,Ga)O, where 

Phosphor for light sources and associated light source

A phosphor for light sources, the emission from which lies in the short-wave optical spectral region, as a garnet structure ABO. It is activated with Ce, the second component B representing at least one of the elements Al and Ga, and the first component A is terbium or terbium together with at least one of the elements Y, Gd, La and/or Lu. In a preferred embodiment, a phosphor having a garnet of structure (TbRECe)(Al,Ga)O, where 

Luminous substance for a light source and light source associates therewith

A casting resin system containing epoxyalkylsiloxane is provided for covering optoelectronic components. The casting resin system includes a resin constituent containing a mixture of epoxyalkylsiloxanes and cycloaliphatic epoxy resins. The casting resin system can be hardened with a polycarboxylic acid anhydride as a hardener component to form molding materials that are transparent and color-stable.

Casting resin of epoxyalkylsiloxane, epoxy resin and anhyride

A surface-mountable opto-component capable of flexible use is disclosed. The opto-component has at least one base member that can be automatically assembled with the assistance of an assembly means and contains at least one optical transmitter and/or receiver. The opto-component also has at least one optical means for shaping the light to be emitted and/or to be received. Adjustment aids serve for the adjusted fastening of the at least one optical means.

Surface-mountable opto-component

A semiconductor chip (1) is bonded to a substrate (2) serving as a component housing, a contact part, an insulative part or a connecting part without the use of a high-temperature process or any additional bonding medium such as solder or flux. The backside of the semiconductor chip (1) or substrate (2) is structured to include specially formed bumps (3) for the necessary connections. A ductile metal is used for these bumps (3). The bond to the substrate (2) is formed by using pressure and/or ultrasonic energy. The process according to this invention is particularly suitable for bonding components in data link receivers, optoelectronic couplers, transmitters (LEDs, IREDs) and ISDN modules.

Process for bonding semiconductor chips to substrates

A hermetically tight glass-metal housing for semiconductor components and a method for producing the housing includes a base support for a semiconductor component in the form of a conducting strip having an upper portion and being suitable for functioning as a lead frame. A mounting pedestal is disposed at the upper portion of the conducting strip. Electrical contacts are disposed at the upper portion of the conducting strip for electrical connections with the semiconductor component. A metal ring is hermetically tightly sealed to the upper portion of the conducting strip. A metal cap surrounds the semiconductor component and the metal ring forms a connecting element for a tight weld with the metal cap.

Hermetically tight glass-metal housing for semiconductor components and

An optoelectronic coupling element and method for manufacturing the coupling element. The coupling element includes a light wave guide, a microlens, a first carrier chip and a light emitting and/or light detecting semiconductor element. The microlens is preferably spherical in shape and is adapted for optically coupling the light wave guide and the semiconductor element. The semiconductor element can be part of the first carrier chip or, according to another embodiment, can be part of a second carrier chip. The purpose of this coupling element is to facilitate the precise mounting of the microlens in a position between the light wave guide and the semiconductor element and also facilitate the adjustment of the microlens to optimally perform its light coupling function. The method for manufacturing the coupling element provides for the formation of a receptacle having trapezoidal shape sides in the carrier chip. The microlens is mounted within the receptacle with a connecting medium such as glass. The size of the receptacle is determined by the size of the microlens and the point of contact between the microlens and carrier. Applications of the optoelectronic coupling element according to the invention are, in particular, in LED transmitter structural elements, receiver structural elements and laser modules. This method of production substantially avoids impairment of the carrier chip due to effects such as mechanical deformation. Additionally, this type of coupling element can be mass-produced cost-effectively in spite of the miniature size of these components.

Optoelectronic coupling element and method for its manufacture

A method for hermetically fastening a glass fiber within a tube, wherein the tube can be used with light wave guide components, the tube serving as a connecting part at the component. The method provides for a tube consisting of quartz, quartz glass or glass. The glass fiber is connected to the tube at a predetermined fastening location by means of heating the tube and collapsing the tube to hermetically connect the glass fiber to the tube through melting.

Method for fastening a glass fiber to a light wave guide component

A useful current component of an electro-optical coupling element is increased by providing a synthetic resin coupling medium having an adhered unitary encapsuling mass composed of the identical synthetic resin forming the coupling medium and containing therein a radiation reflecting material, such as titanium dioxide and a radiation impermeable material, such as aluminum bronze.

Growing community of inventors

Wuppertal, Germany

Guenther Waitl