Harman Becker Automotive Systems Gmbh

Guenther Kraft

Valod Noshadi

Gregor Slatosch

Jibin Yuan

Thomas Erforth

Frank Gitzinger

Christian Schanz

Peter Stachulla

Didier Berthomier

Marco Stadler

Frank Foerderer

Michael Huonker

Krunoslav Orcic

Wieland Oberst

Bruno Achauer

Walter Knappich

Kelei Shen

Arno Kutzki

Thomas Schiemann

Peter Kies

Krunoslac Orcic

Stephan Joos

Embodiments are disclosed for a system for coupling with at least one vehicle cable for communication with components of an infotainment system. In one example, the system includes a housing and a domain controller with hardware components enclosed within the housing. The system may further include a first connector interface arranged at a first side of the housing, the first connector interface including all connections for the domain controller.

Systems and methods for scalable cockpit controller

Embodiments are disclosed for a standardized car interface for cockpit controllers in vehicles. In one example, a system for coupling a vehicle cable for communication with components of an infotainment system, comprises: a housing, a domain controller, and a first connector interface including all connections for the domain controller. In the event that a first domain controller is exchanged for a second domain controller, a collection of user preferences may be transferred between the first domain controller to the second domain controller.

Systems and methods for scalable cockpit controller with generic and reconfigurable car-interface

An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.

Electronic module

A vehicle computing system includes a vehicle computing module mounted on a main system board. The module includes a computing module circuit board with computing components mounted thereon including a central processing unit and a main memory. An edge connector connects the computing module circuit board to an edge connector socket on the main system board. A plurality of computing function interfaces are connected to the edge connector, and include a configuration interface connected to the central processing unit and, via the edge connector, to a controller on the main system board. The controller configures the central processing unit for operation in the vehicle computing system by enabling specification of the computing function interfaces during a vehicle computing module configuration. The computing function interfaces are configured during the vehicle computing module configuration to process data received by the vehicle computing module via the computing function interfaces.

Vehicle computing module

Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.

Method for producing a circuit board system

An electronic component is provided that includes a spatial light modulator device, and a circuit board comprising a first major surface, at least one electrically conductive redistribution layer and a first cavity positioned in the first major surface. The spatial light modulator device is positioned within the cavity and is electrically connected to the redistribution layer.

Electronic component

Growing community of inventors

Karlsruhe, Germany

Guenther Kraft