Siemens Aktiengesellschaft

Osram Opto Semiconductors Gmbh

Other

Guenter Waitl

Franz Schellhorn

Georg Bogner

Karlheinz Arndt

Werner Spaeth

Bert Braune

Guenther Hirschmann

Werner Kuhlmann

Hubertus Thoresia Hintzen

Alfred Langer

Jost W H Van Krevel

Joerg Klann

Lee Francis

Hans Wissinger

Hans-Joachim Hampel

Reinhard Weitzel

Hans-Juergen Richter

Ir G Botty

Helmut Rusch

Hansjoerg Harrasser

Alois Seidl

An LED array surface-mounted on a circuit board and applied to a cooling member, such that any generated heat is optimally eliminated. The cooling member can be in any desired shape so that motor vehicle lights, such as blinkers, can be adapted to the outside contour of the vehicle. For a rotating light, the circuit board can be applied around a cooling member fashioned as a hollow cylindrical member which is adapted to rotate.

Light-emitting diode arrangement

An opto-electronic semiconductor element has a radiation emitting or receiving, that is, radiation active semiconductor chip secured to an electrically conductive base frame. One, or a plurality of chips, are surrounded by a housing which may be integral with or have, separately, a cover. All materials of the housing, as well as of the conductive base frame, have mutually matching thermal coefficients of expansion within the temperature ranges which arise during manufacture and in application of the semiconductive element, singly or as a plurality in a common housing. Glass, quartz glass, ceramic or glass ceramic are suitable for the housing or parts thereof; the conductive base frame is preferably made of cladded or jacketed copper wire or strip with an iron-nickel core. Assembling a plurality of chips in a housing which has a luminescence conversion layer, e.g. a phosphor applied thereto, permits construction of a flat light source.

Thermal expansion compensated opto-electronic semiconductor element, particularly ultraviolet (UV) light emitting diode, and method of its manufacture

A light source uses a yellow to red emitting phosphor with a host lattice of the nitridosilicate type M Si N :Eu, wherein M is at least one of an alkaline earth metal chosen from the group Ca, Sr, Ba and wherein z&equals;2/3x&plus;4/3y.

Light source using a yellow-to-red-emitting phosphor

An optical connection between an optoelectronic structural element and a fiber-optic beam waveguide is described which is reliable, simple, and space-saving. A lens and a hollow cylinder are integrated in the structural component of optoelectronic structural elements. Each end of a fiber-optic beam waveguide is inserted into the hollow cylinders, and the optoelectronic structural elements are connected with the aid of a heat-shrinkable tubing with the fiber-optic beam waveguide such that the ends of the light beam waveguide to be coupled abut each of the lens integrated into the optoelectronic structural elements. An optocoupler according to the invention may be advantageously used in motor vehicles, in electromedicine, in power electronics, in robot control, in sensory analysis, and in 'instrumentaion-control-regulation' tasks.

Optocoupler apparatus

A surface-mountable opto-component has at least one transmitter and/or receiver and is capable of being flexibly employed. The surface-mountable opto-component has at least two surfaces and at least two electrical terminals at each of these at least two surfaces so that the opto-component is optionally mountable at each of these two surfaces.

Surface-mountable opto-component

An optical emission device with an emitter semiconductor chip and a cover intended to be suitable for backlighting areas, the device having a comparatively low structural height and low packing density. The cover has a light aperture formed using a convex and concave lens for radiating light in a solid angle of maximum size. This device can also be used in combination with an additional external reflector and diffusion screen.

Optical emission device

A lead frame adapted for a plurality of semiconductor chips in which, for each semiconductor chip, at least one electric terminal is extended out of the package after encapsulation of the lead frame. In addition, a process for the production of a lead with this lead frame, enables a full automation of the lead assembly and good, reliable production. The lead frame has at least one mechanical node (T1, T2, T3, T4; T) at which, by severing a single reinforced node, at least three electric conductors (1, 2, G; 3, 4, G; 5, 6, G; 7, 8, G; 21, 22, 23) are electrically separated from one another.

Lead frame and a process for the production of a lead with this lead

In order to manufacture respectively optocouplers or reflex light barriers particularly efficiently, semiconductor light transmitters and semiconductor light receivers are situated on a single substrate. The optic coupling or optic isolation of light transmitter and light receiver takes place in the substrate. Only then are semiconductor elements separated into discrete units.

Method for producing an optocoupler

Growing community of inventors

Wuppertal, Germany

Guenter Waitl