Qualcomm Incorporated

Gudoor Reddy

Mikhail Popovich

Joon Hyung Chung

Seung Hyuk Kang

Ramaprasath Vilangudipitchai

Kamesh Medisetti

Samrat Sinharoy

Smeeta Heggond

Anil Kumar Koduru

A cell on an IC includes a first set of Mlayer interconnects coupled to a first voltage, a second set of Mlayer interconnects coupled to a second voltage different than the first voltage, and a MIM capacitor structure below the Mlayer. The MIM capacitor structure includes a CTM, a CBM, and an insulator between portions of the CTM and the CBM. The first set of Mlayer interconnects is coupled to the CTM. The second set of Mlayer interconnects is coupled to the CBM. The MIM capacitor structure is between the Mlayer and an Mlayer. The MIM capacitor structure includes a plurality of openings. The MIM capacitor structure is continuous within the cell and extends to at least two edges of the cell. In one configuration, the MIM capacitor structure extends to each edge of the cell.

MIMCAP architecture

The place and route stage for a hard macro is modified to assign a more robust power-grid tier to a critical path for a hard macro and to assign a less robust power-grid tier to a remainder of the hard macro.

Adaptive multi-tier power distribution grids for integrated circuits

The place and route stage for a hard macro including a plurality of tiles is modified so that some of the tiles are assigned a more robust power-grid tier and so that others ones of the tiles are assigned a less robust power-grid tier.

Growing community of inventors

San Diego, CA, United States of America

Gudoor Reddy