Goertek Inc.

Weifang Goertek Microelectronics Co., Ltd.

Guanxun Qiu

Mengjin Cai

Qinglin Song

Junkai Zhan

Zonglin Zhou

Quanbo Zou

Zhe Wang

Maoqiang Dang

Jifang Tao

The present disclosure discloses a sensitive diaphragm comprising a diaphragm body, an edge region of the diaphragm body being provided with a rim structure, wherein the rim structure is in a non-closed annular shape, a non-closed region is located at a part not closed by the rim structure, and the non-closed region are integral and continuous with parts of the diaphragm body adjacent to the rim structure. According to the sensitive diaphragm of the present disclosure, the annular rim structure is separated by the non-closed region.

Sensitive diaphragm with rim structure and sensor

An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm () and back-pole () which forms a condenser structure are formed on a substrate () having at least one recessed slot () on the top. A sensitive electrode is formed on the substrate (), the sensitive electrode comprising a fixed portion () fixed on the substrate () via a sacrificial layer (), and a bending portion () inserted into the recessed slot (), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm () and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate () at the same time, from the same material, and using the same fabricating process to increase production efficiency.

Acoustic sensor integrated MEMS microphone structure and fabrication method thereof

The present invention discloses a microphone, comprises: a silicon substrate; a diaphragm disposed over the silicon substrate; a backplate disposed over the diaphragm, the backplate having a plurality of through holes formed therein and a barrier structure, and the plurality of through holes being arranged in a through hole pattern on the backplate; the barrier structure having one or more protruding portions extending from at least one part of the through hole wall of the barrier structure, thereby the section shape of at least one through hole being an irregular shape with one or more inwardly concave portion. The microphone provided by the present invention can achieve a better dustproof effect.

Microphone with dustproof through holes

A method for forming a filter net on an MEMS sensor and an MEMS sensor are disclosed. The method comprises the following steps: disposing a dissociable adhesive tape on a base material, and forming a filter net on an adhesive surface of the dissociable adhesive tape; transferring the filter net on a film to form a self-adhesive coiled material; and transferring and adhering the filter net on the self-adhesive coiled material to collecting a hole of the MEMS sensor. The filter net formed by the method have fine and uniform meshes, and a yield is high. In addition, the method is suitable for large-scale and industrialized production.

Method for forming filter net on MEMS sensor and MEMS sensor

The present invention provides a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate to obtain an insulating layer thereon and providing a metal layer on the insulating layer; providing a sacrificial layer on the metal layer; providing a first thermal bimorph layer on the sacrificial layer; providing a second thermal bimorph layer on the first thermal bimorph layer; providing a metal connecting layer at the positions on the metal layer where the sacrificial layer is not provided; forming corresponding back holes on the substrate and the insulating layer and releasing the sacrificial layer; forming the thermal bimorph diaphragm which is warped with the first thermal bimorph layer and the second thermal bimorph layer after the sacrificial layer is released.

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Weifang, China

Guanxun Qiu