Ford Global Technolgoies, LLC

Guangyin Lei

Michael W Degner

Edward Chan-Jiun Jih

Chingchi Chen

Zhuxian Xu

Alfredo R Munoz

Akash Changarankumarath Pradeepkumar

Xi Lu

Tienli Wang

Krishna Prasad Bhat

Franco Leonardi

Richard William Kautz

Ke Zou

Prasad Dev Hanumalagutti

Mark Allan Lippman

Lan Yu

Jun Kikuchi

Nevin Altunyurt

Arvind Govindaraj

Andreas R Schamel

Edward Jih

Ming Su

Mansur A Blackman

A vehicle power module assembly including first and second power modules is provided. The first power module may include a first lock feature extending from a lower portion of a first minor side at a first central axis. The second power module may include a second lock feature at an upper portion of a second minor side at a second central axis. The lock features may be sized for interlock with one another to secure the power modules to one another. The first lock feature may be a loop element defining a through-hole and the second lock feature may be a wedge. The through-hole may be sized for the wedge to extend therein and to interlock the first power module and the second power module to one another. The first lock feature may be a flexible hook element and the second lock feature may be a slot.

Vehicle power module assembly

An electric vehicle power supply includes a housing, a power supply, and a plurality of fasteners. The housing defines an internal cavity and has inwardly protruding tabs that extend into the cavity. The power assembly has a front cover and an end cover. The power assembly also has an array of electrical switching units arranged horizontally between the front and end covers. The front and end covers have outwardly protruding tabs. Each of the plurality of fasteners extend vertically, engage one inwardly protruding tab, and engage one outwardly protruding tab to secure the power assembly to the housing.

Power supply device

A method of forming a power-module assembly includes arranging power stages in a cavity of a container such that the power stages are spaced apart from walls of the container. The method further includes inserting a core between each of the power stages, and installing a manifold on top of the power stages. The method also includes putting resin into the cavity to form a housing of the power-module assembly, and removing the core to reveal coolant chambers between each of the power stages.

Power-module assembly

Power modules of a power module assembly each have a power card including a substrate, signal pins, and power terminals, and a casing over molded on the power card to define a passageway extending between opposite ends of the power module, and a continuous uninterrupted thermal path from the power card to the passageway. The modules are arranged end-to-end to define a continuous fluid pathway via the passageways.

Modular power module with integrated coolant passageway and assemblies thereof

A testing apparatus includes a holster including a jack defining a conductive periphery configured to connect with a reference lead of the voltage probe to form a common ground. The apparatus includes a shunt defining first and second regions of different potential having predetermined difference. The second region is configured to connect with a reference lead of the shunt probe. The apparatus includes a bridge configured to connect the shunt probe lead with the common ground.

Power module testing apparatus

A vehicle power module assembly including an array of stacked switch unit assemblies, a front cover, first and second side rails, and an end cover is provided. Each of the assemblies may include a power stage frame having a mid-cutout located at a substantially central side frame region such that a mid-cutout region is defined along each side of the array. The front cover may be disposed at a first end of the array. The first and second side rails may each extend from the front cover and each may be disposed within one of the mid-cutout regions such that an outer surface of each side rail is substantially flush with an outer surface of a respective power stage frame. The end cover may be arranged with the front cover to retain the assemblies therebetween. The assembly may further include a clamping plate and a spring element.

An inverter for an electric vehicle drive has a bridge configuration using power transistors packaged in actively cooled power modules. Control electrodes in the power modules carrying gate signals to drive the transistors contain inductive coils to increase a common source inductance in order to reduce power losses. Each inverter power module comprises a pair of transistor dies with output electrodes defining a power loop. The control electrodes with inductive coils carrying respective gate signals are arranged to be magnetically coupled with the power loop. For active cooling, a heat conductive plate underlies the dies. A magnetic interrupter is disposed at the heat conductive plate. A localized eddy current preventer is interposed at the heat conductive plate in alignment with the inductive coils to avoid eddy currents that could otherwise reduce the coupling of the inductive coils with the power loop.

Power module for inverter switching devices having gate coils shielded from eddy currents

A power module includes a packaging structure having a pair of side-by-side spaced apart busbars, each connected to a corresponding switch. The power module includes a conductive pad, between and electrically isolated from the busbars and the switches, and configured to, responsive to flow of current through the busbars generated by the switches and resulting in power loop magnetic flux between the busbars, generate magnetic flux that partially cancels the power loop magnetic flux.

Reduction of packaging parasitic inductance in power modules

A method includes measuring an impedance of a shunt as a function of frequency and converting the impedance to an admittance in a time domain. The method further includes connecting the shunt in a circuit and measuring voltage data across the shunt over a predetermined interval. The method includes outputting a signal indicative of a current through the shunt derived from the voltage data convolved with the admittance. The method may be implemented in a controller configured to interface with the shunt.

Ultra-high bandwidth current shunt

A vehicle power system may include a power module assembly having a plurality of alternating heatsinks and phase legs arranged in a deck. Each of the phase legs includes a semiconductor switch in contact with a dielectric layer. The dielectric layer is sandwiched between the switch and one of the heatsinks such that heat generated by the switch is transferred to the heatsink via the dielectric. At least one of the heatsinks may define a coolant channel. The coolant channel may be U-shaped. The coolant channel may have inlet and outlet regions. The inlet region may be opposite the outlet region. The coolant channel may have a divider to segregate ingress and egress coolant paths. The coolant channel may have obstructions to form a tortuous path. The obstructions may be wavy fins.

Vehicle power module assembly with cooling

According to one embodiment, a power-module assembly includes a power-module stack having coolant chambers interleaved with power modules and supply and return manifold channels extending axially along the stack. An endcap has a major side defining recessed inlet and outlet manifold cavities aligned with the channels and inlet and outlet ports disposed on one or more minor sides that are perpendicular to the major side.

Power-module assembly with endcap

A capacitor comprising first and second end sprays respectively located at distal ends of a capacitor cell, a positive polarity bus bar extending from a first wound conductive layer of the capacitor cell adjacent to the first end spray, a negative polarity bus bar extending from a second wound conductive layer of the capacitor cell adjacent to the second end spray, and a capacitor film wrapped around an area between the first and second conductive layers.

Low inductance capacitor

A vehicle power supply includes a housing, a backing plate, a power assembly, and a clamp. The housing has a bottom wall and a side wall. The backing plate extends from the bottom wall. The power assembly has an array of electrical switching units that extend from the side wall to the backing plate. The clamp extends from the backing plate and is configured to engage a backside of the array such that a frontside of the array is forced into engagement with the side wall.

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Dearborn Heights, MI, United States of America

Guangyin Lei