Telefonaktiebolaget Lm Ericsson (publ)

Beijing University of Technology

Guangsheng Guo

Ang Feng

Jinlai He

Yaxin Xing

Siyu Wang

Xiayan Wang

Qiaosheng Pu

A method for antenna calibration for an active antenna system is disclosed. According to an embodiment, test signals are generated for multiple antennas of the active antenna system. The test signals are transmitted via the multiple antennas. A first signal that results from the transmission of the test signals is received over the air. A second signal is received from a coupler network of the active antenna system. The coupler network is configured to generate coupled signals of the test signals and combine the coupled signals into the second signal. Calibration information for compensating an influence of the coupler network is determined based on the first and second signals. An active antenna system is also disclosed for use in antenna calibration.

Method for antenna calibration and active antenna system for use in antenna calibration

The plasma-assisted method of precise alignment and pre-bonding for microstructure of glass and quartz microchip belongs to micromachining and bonding technologies of the microchip. The steps of which are as follows: photoresist and chromium layers on glass or quartz microchip are completely removed followed by sufficient cleaning of the surface with nonionic surfactant and quantities of ultra-pure water. Then the surface treatment is proceeded for an equipping surface with high hydrophily with the usage of plasma cleaning device. Under the drying condition, the precise alignment is accomplished through moving substrate and cover plate after being washed with the help of microscope observation. Further on, to achieve precise alignment and pre-bonding of the microstructure of glass and quartz microchip, a minute quantity of ultrapure water is instilled into a limbic crevice for adhesion, and entire water is completely wiped out by vacuum drying following sufficient squeezing. Based on the steps above, it is available to achieve permanent bonding by further adopting thermal bonding method. In summary, it takes within 30 min to finish the whole operation of precise alignment and pre-bonding by this method. Besides, this method is of great promise because of its speediness, efficiency, easy maneuverability, operational safety and wide applications.

Plasma assisted method of accurate alignment and pre-bonding for microstructure including glass or quartz chip

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Beijing, China

Guangsheng Guo