Ansys, Inc.

Guangran Zhu

J Eric Bracken

Werner Thiel

Systems and methods are provided for analyzing a via. A physical representation of a via intersecting with an upper layer and a lower layer is received, the physical representation comprising: (i) a pair of pad dimensions comprising an upper pad dimension aand a lower pad dimension a, and/or (ii) a pair of anti-pad dimensions comprising an upper anti-pad dimension band a lower anti-pad dimension b, where at least one of first and second conditions: (A) the first condition being ais different than a, and (B) the second condition being bis different than b, is true. A determination is made as to which, if any, of the conditions are true. At least one model parameter is selected based on the determination. An admittance parameter corresponding to a section of the via located between the upper and lower layers is computed using the selected model parameter.

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Oakdale, PA, United States of America

Guangran Zhu